Abstract: Low pH acidic compositions for uses related generally to chemical, pharmaceutical and cosmetic agents and more particularly, but not limited to, used as bactericides, fungicides, germicides and virucides; all having pH values of less than about 2.0 in their final form. These low pH acidic compositions generally comprise two phases in solution. Phase I comprises from about 2 to about 98 weight percent of varying percentages of several chemical, pharmaceutical and cosmetic substances.Phase II comprises from about 2 to about 99 weight percent of an active aqueous acidic component having a pH value of less than about 1.

Abstract: An acidic solution for use as a cleaning composition for copper and copper alloys includes a solution of from about 1-20 weight percent hydrochloric acid and approximately 80-99 weight percent of an aqueous hydrochloric acid-based composition which has a pH of less than about 1.0 yet is substantially non-reactive with compounds having low oxidative states, including human skin tissue.

Abstract: An acidic solution for use as a radiator cleaning composition includes an aqueous solution of from about 1-8 weight percent an ethylene glycol base, and about 2-45 weight percent hydrochloric acid. In addition, approximately 2-45 weight percent of an aqueous hydrochloric acid-based composition is included, which composition has a pH of less than about 1.0 yet is substantially non-reactive with compounds having low oxidative states, including human skin tissue.

Abstract: An acidic solution for use as an aluminum cleaning and brightening composition includes an aqueous solution of from about 1-15 weight percent hydrofluoric acid, about 1-5 weight percent sulfuric acid, and about 1-5 weight percent phosphoric acid. In addition, approximately 83-97 weight percent of an aqueous hydrochloric acid-based composition is included, which composition has a pH of less than about 1.0 yet is substantially non-reactive with compounds having low oxidative states, including human skin tissue.

Abstract: An improved plating solution for metal plating iron-containing metallic substrates comprising from about 1 to about 35 weight percent of an aqueous solution containing metal ions to be deposited on the substrate, and from about 65 to about 99 weight percent of an aqueous acidic component having a pH value of less than about 1. The aqueous acidic component is produced by (a) admixing from about 45 to about 85 weight percent hydrochloric acid with from about 20 to about 55 weight percent phosphoric acid in a suitable vessel for an effective period of time to produce a substantially homogeneous acidic mixture; (b) admixing the homogeneous acidic mixture with an effective amount of water to provide an aqueous acidic mixture; and (c) admixing from about 2 to about 20 weight percent of a hydroxy carboxylic acid and from about 0 to about 20 weight percent of a dicarboxylic acid with the aqueous acidic mixture.

Abstract: An acidic glass cleaning composition for removal of residue, deposits and impurities from glassware is provided, the improved acidic glass cleaning composition comprising from about 1 to about 15 weight percent hydrofluoric acid and from about 85 to about 99 weight percent of an aqueous acidic composition having a pH value of less than about 1.