Abstract: An electroless copper plating solution containing, in aqueous medium, cupric ions, hydroxyl radicals, complexing agent for cupric ions, formaldehyde and a formaldehyde addition agent; wherein the molar ratio of each of copper and free formaldehyde to hydroxyl radical is between 1 to 10 and 1 to 40.

Abstract: A process for the metal plating of aluminum comprising the steps of electrolytically anodizing the surface of the aluminum, immersing the anodized aluminum into an electrolytic plating solution and initiating deposition by passing a current through the solution for a time sufficient to form a layer of metal over the aluminum. The process is especially useful for the formation of aluminum storage discs where the electrolytic metal is a single layer of a ferromagnetic metal.

Abstract: An electroless nickel plating composition characterized by the addition of a polymer formed from a 2-acrylamido or 2-methacrylamido alkyl sulfonic acid monomer. The polymer additive increases the rate of deposition from solution, and to a minor extent, improves the appearance of a nickel deposited from the solution.

Abstract: Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of a heterocyclic nitrogen compound containing at least one free mercapto group substitution.

Abstract: Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of a thioamide having the general formula ##STR1## wherein R is an aryl or a heterocyclic group.

Abstract: Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of a polysulfide compound having the general formula ##STR1## wherein R is a hydroxyl group, a carboxyl group, a sulfonic acid group or a sulfonic acid salt group, each X independently from each other can be hydrogen, hydroxyl or C.sub.1 -C.sub.4 alkyl, each Y independently from each other can be hydrogen, hydroxyl or C.sub.1 -C.sub.4 alkyl, m is an integer from 1 to 18, and n is an integer from 2 to 5.

Abstract: Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of 3-sulfopropyldithiocarbamate sodium salt having the general formula ##STR1## wherein R can be a C.sub.1 -C.sub.4 alkyl group, phenyl, a C.sub.7 -C.sub.10 alkaryl group or a C.sub.7 -C.sub.10 aralkyl group.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. 0.005 gram per liter to 10.0 grams per liter of quaternized aryl and aralkyl amines selected from those exhibiting the formulae: ##STR1## wherein R', R", R'" and R"" are each independently selected from the group consisting of substituted and unsubstituted monovalent alkyl, aryl, aralkyl and cycloalkyl radicals provided that at least one aryl or aralkyl radical is present on each quaternary nitrogen atom; wherein Z is a bivalent hydrocarbon radical which may be substituted and/or interrupted by heteroatoms; wherein n=3 or 4; and wherein the Anion may be absent if one of the radicals R' to R"" carries an anionic substituent.B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. from 0.005 to 1.0 gram per liter of at least one member of the group consisting of basic diaminotriphenylmethane dyes, basic triaminotriphenylmethane dyes, basic triaminodiphenylnaphthylmethane dyes and their reduction products; andB. sulfoalkyl sulfide compounds containing the grouping RS.sub.n --Alk--SO.sub.3 M where n is an integer 1 to 5, where M is one gram-equivalent of a cation, where --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms, and where R is selected from a group consisting of hydrogen, a metal cation, a monovalent hydrocarbon radical including one which carries inert substituents, a sulfonic group MO.sub.3 S-- and a sulfolanyl group in an amount of 0.01 milligrams per liter to 1000 milligrams per liter.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl amine selected from those exhibiting the formulae: ##STR1## and its reaction product.sup.2 with propane sultone; ##STR2## wherein Z is selected from the group consisting of oxygen and --NCH.sub.2 --C.sub.6 H.sub.5 ;B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to a process and to novel compositions for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member from each of the following two groups:A. an N-heteroaromatic compound containing 1 or 2 N-heteroaromatic rings, said rings being selected from a group comprising pyridine, quinoline, isoquinoline and the benzoquinolines, which compound does not contain non-quaternary amino groups that are not part of the said N-heteroaromatic rings, nor bivalent sulfur atoms, and is not quaternized on its ring nitrogen atoms by aralkyl, aryl, alkaryl radicals; andB. sulfoalkylsulfide and sulfoarylsulfide compounds containing the grouping --S.sub.n --X--SO.sub.3 M where n = 1 to 5, --X-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms or a divalent aromatic or aliphatic-aromatic hydrocarbon group of 6 to 12 carbon atoms and M is one gram-equivalent of a cation.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl amine exhibiting the formula ##SPC1##B. sulfoalkyl sulfide compounds containing the grouping --S--AlK--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. a bath soluble amine selected from those exhibiting the formula: ##SPC1##wherein Y and Z are independently selected from the group consisting of hydrogen, benzyl, phenyl, R-SO.sub.3 .sup.- wherein R is an alkyl of from one to seven carbon atoms;B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl amine exhibiting the formula: ##SPC1##B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and -Alk- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl amine selected from those exhibiting the formulae: ##SPC1##B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram - equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl, aralkyl or cycloaliphatic amine exhibiting the formula: ##EQU1## wherein X, Y, and Z are each independently selected from the group consisting of hydrogen, substituted and unsubstituted benzyl, phenyl, and cyclohexyl rings; --CH.sub.2 R, --CH.sub.2 RSO.sub.3, --CH.sub.2 ROH where R is a substituted or unsubstituted alkyl chain of one or two carbon atoms ##EQU2## Z where n is an integer of one to 7, and ##EQU3## provided that not more than two members of X, Y, and Z are hydrogen, B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

Abstract: This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:A. an aryl quaternary N-heteroaromatic or N-heteroaliphatic ring compound or salt exhibiting the structure: ##EQU1## WHEREIN R is selected from the group consisting of phenyl, benzyl and p-xylyl and the N-Ring is selected from the group consisting of substituted and unsubstituted N-heteroaliphatic rings and substituted and unsubstituted N-heteroaromatic rings; Y is present or absent; Y, when present, represents an anionic moiety, n is 1 save when R is p-xylyl n is 2;B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.