Abstract: An electrical arrangement has a first electrically conductive contact point (10) and a second electrically conductive contact point (20), the first and the second contact point being arranged at a distance (x) from one another and being electrically connected to one another via a wire connection arrangement (30), the wire connection arrangement (30) being formed by at least two wire connections (31-1, 31-2, . . . , 31-n-1, 31-n) which have respectively a first end (32-1, 32-1, 32-n-1, 32-n) and a second end (33-1, 33-2, . . . , 33-n-1, 33-3), and the first end of a wire connection (30-2, . . . , 30-n) and the second end of a preceding wire connection (30-1, . . . , 30-n-1) being in direct contact with one another.

Abstract: A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

Abstract: A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

Abstract: The invention relates to a ceramic mass (1) consisting of one ceramic material (2) and at least one other kind of ceramic material (3) different therefrom. Glass material (4) is arranged between the ceramic materials. The glass material reduces the sintering temperature of the ceramic mass and prevents the various ceramic materials from forming a mixed crystal when the ceramic mass is sintered. The ceramic mass is suitable for use in LTCC technology for the production of capacitors whose permittivity is dependent upon a specific temperature range.

Abstract: The invention is directed to an extremely low-capacitance device for shaping an electron beam. The device is based on a ceramic body having a monolithic multi-layer structure. The manufacture of the ceramic body ensues with the assistance of LTCC technology, whereby this method is designationally modified. The body is constructed of pre-sintered ceramic layers whose lateral shrinkage is suppressed. The through apertures of the electrodes for the electron beam are thus arranged exactly coaxially, and the tolerances of the electrode dimensions are decoupled from the shrinkage during sintering. The electron beam of an electron gun is focused and the intensity thereof is modulated with the assistance of such a device.