Patents by Inventor Silvia Kronmueller
Silvia Kronmueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7317233Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.Type: GrantFiled: June 21, 2005Date of Patent: January 8, 2008Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Silvia Kronmueller
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Patent number: 7288824Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.Type: GrantFiled: December 30, 2005Date of Patent: October 30, 2007Assignee: Robert Bosch GmbHInventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Patent number: 7270868Abstract: A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.Type: GrantFiled: July 14, 2003Date of Patent: September 18, 2007Assignee: Robert Bosch GmbHInventors: Thorsten Pannek, Udo Bischof, Silvia Kronmueller, Jens Frey, Ulf Wilhelm
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Patent number: 7262071Abstract: A micromechanical component having a substrate conductive in at least some regions; an elastically deflectable diaphragm, which is conductive in at least some regions, arches over a front side of the substrate, and is electrically insulated from the substrate, the diaphragm having an inner region (I; I?) and an edge region (RB; RB?); and a hollow space (H), which is provided between the substrate (1) and the diaphragm (M); the inner region (I; I?) having a cross-section that is modified in comparison with the edge region (RB; RB?), which means that the bending of the inner region (I; I?) is less than that in the case of an identical cross-section.Type: GrantFiled: January 30, 2006Date of Patent: August 28, 2007Assignee: Robert Bosch GmbHInventors: Franz Lärmer, Silvia Kronmüller, Christina Leinenbach
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Patent number: 7075160Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.Type: GrantFiled: June 4, 2003Date of Patent: July 11, 2006Assignee: Robert Bosch GmbHInventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20060108652Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.Type: ApplicationFiled: December 30, 2005Publication date: May 25, 2006Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20060054972Abstract: A method and device are for anchoring fixed structural elements and, e.g., for anchoring electrodes for components, e.g., SOI wafer components, whose component structure is formed in a silicon layer on top of a substrate used as support. The fixed element may be mechanically connected to the substrate via at least one anchoring element made of an anchoring material and extending through the silicon layer. In the case of an SOI wafer, the anchoring element may extend through the silicon layer and the sacrificial layer of the SOI wafer. To this end, in the area of the surface of the fixed element, at least one recess is made in the silicon layer, which may extend through the entire silicon layer and the sacrificial layer down to the substrate. The recess may then be filled with an anchoring material, so that the fixed element is mechanically connected to the substrate via the anchoring element that is thereby created.Type: ApplicationFiled: December 11, 2002Publication date: March 16, 2006Inventors: Silvia Kronmueller, Ulf Wilhelm
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Publication number: 20050253209Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.Type: ApplicationFiled: June 21, 2005Publication date: November 17, 2005Inventors: Markus Lutz, Aaron Partridge, Silvia Kronmueller
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Patent number: 6952041Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.Type: GrantFiled: July 25, 2003Date of Patent: October 4, 2005Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Silvia Kronmueller
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Patent number: 6936491Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the chamber. The contact area is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench that is disposed around the contact area. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits.Type: GrantFiled: June 4, 2003Date of Patent: August 30, 2005Assignee: Robert Bosch GmbHInventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20050156260Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the chamber. The contact area is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench that is disposed around the contact area. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits.Type: ApplicationFiled: March 11, 2005Publication date: July 21, 2005Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20050106318Abstract: A silicon oxide layer is formed by oxidation or decomposition of a silicon precursor gas in an oxygen-rich environment followed by annealing. The silicon oxide layer may be formed with slightly compressive stress to yield, following annealing, an oxide layer having very low stress. The silicon oxide layer thus formed is readily etched without resulting residue using HF-vapor.Type: ApplicationFiled: November 14, 2003Publication date: May 19, 2005Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20050054134Abstract: A method for manufacturing a microsystem is provided, which microsystem has a first functional layer situated on a substrate provided with an integrated circuit, the first functional layer including a conductive area and a sub-layer, and a second mechanical functional layer situated on the first functional layer. In the manufacturing method, the second mechanical functional layer is first applied to a sacrificial layer situated on the first functional layer and structured. In addition, a protective layer is provided in selected areas on the side of sub-layer facing away from the conductive area, such that as the sacrificial layer is etched, etching of the areas of the first functional layer covered by the protective layer is prevented, and in the areas of the first functional layer without the protective layer, the sub-layer is selectively etched simultaneously with the sacrificial layer, down to the conductive area.Type: ApplicationFiled: July 22, 2004Publication date: March 10, 2005Inventors: Wilhelm Frey, Silvia Kronmueller, Christoph Duenn, Gary Yama, Jochen Zoellin
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Publication number: 20050019974Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.Type: ApplicationFiled: July 25, 2003Publication date: January 27, 2005Inventors: Markus Lutz, Aaron Partridge, Silvia Kronmueller
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Publication number: 20040248344Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.Type: ApplicationFiled: June 4, 2003Publication date: December 9, 2004Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20040245586Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the chamber. The contact area is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench that is disposed around the contact area. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits.Type: ApplicationFiled: June 4, 2003Publication date: December 9, 2004Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20040183214Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.Type: ApplicationFiled: March 20, 2003Publication date: September 23, 2004Inventors: Aaron Partridge, Markus Lutz, Silvia Kronmueller
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Publication number: 20040081802Abstract: A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.Type: ApplicationFiled: July 14, 2003Publication date: April 29, 2004Inventors: Thorsten Pannek, Udo Bischof, Silvia Kronmueller, Jens Frey, Ulf Wilhelm