Abstract: A method is described for selectively depositing a metallic layer (10) including one or more of copper, silver and gold. The method includes depositing a fluorinated layer (5) over a surface (1, 4). The fluorinated layer (5) has a thickness sufficient to substantially prevent deposition of the copper, silver and/or gold between the fluorinated layer (5) and the surface (1, 4) during a subsequent evaporation step using a given deposition rate. The method also includes forming the metallic layer (10) by evaporating, at the given deposition rate, the copper, silver and/or gold over the surface (1, 4) and the fluorinated layer (5). The copper, silver and/or gold preferentially adhere to the portions of the surface (1, 4) not covered by the fluorinated layer (s).