Abstract: A carrier for dual-in-line packages to be wave soldered, comprises a frame with tracks into which the packages can be slid. The tracks are defined by aligned upper and lower "U"-shaped channel members providing rails. Each track is defined between adjacent pairs of upper and lower members. Gates at either end of the tracks control movement of the packages into or out of the carrier. The carrier can be loaded and unloaded by means of apparatus including an inclined ramp on which the carrier can be releasably located, the packages being fed into the top of the ramp to fill the carrier, and sliding to the bottom of the ramp to empty the carrier of soldered packages prior to re-filling. Movement of the packages down the ramp is controlled by gates.