Patents by Inventor Sim Fah LEONG

Sim Fah LEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160172276
    Abstract: Various embodiments provide a clip for clip bonding of a die to a carrier (bonding clip), wherein the clip comprises a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die.
    Type: Application
    Filed: December 12, 2015
    Publication date: June 16, 2016
    Inventors: Xavier AROKIASAMY, Sim Fah LEONG