Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.

Abstract: An electronic module includes a substrate, at least one surface mountable integrated circuit (IC) component and a conductive polymer. The substrate includes a plurality of electrically conductive traces formed on at least one surface of the substrate. The at least one surface mountable integrated circuit component includes a plurality of conductive pads formed on at least a first surface of the component and the conductive pads are electrically coupled to at least one of the conductive traces. The conductive polymer is in contact with at least a portion of a second surface, which is opposite the first surface, of the component and the substrate.

Abstract: An electronic package is provided having a surface mount electronic device connected to a circuit board. The package includes a circuit board and a surface mount electronic device. A mounting pad is formed on the circuit board. A plurality of vias are formed each having an opening extending into the circuit board and extending through the mounting pad. The package further includes a solder joint connecting a contact terminal of the surface mount device to the mounting pad on the circuit board. The solder joint extends at least partially into the openings in each of the plurality of vias to support the arrangement of the surface mount device on the circuit board.