Abstract: Methods of forming a graphene integrated core for making a printed circuit board (PCB) having enhanced thermal management properties are disclosed. The methods include providing a core body having a core body length and applying a graphene multi-layer to the core body to form a laminated stack, where the graphene multi-layer has a graphene multi-layer length that is shorter than the core body length. At least one conductive layer may be applied to the laminated stack. The graphene multi-layer may be disposed within the graphene integrated core such that the graphene multi-layer is electrically insulated from the at least one conductive layer. Corresponding graphene integrated cores having a graphene multi-layer that is disposed within the graphene integrated core such that the graphene multi-layer is electrically insulated from the at least one conductive layer are also described.

Abstract: Methods for integrating copper-graphene laminate (CGL) in a multilayer PCB fabrication process and the resulting lamination stacks are disclosed. The methods include providing a core and applying a first graphene layer to the surface of the core. The methods further include applying a metal layer to the first graphene layer and applying a second graphene layer to the metal layer. Further, the methods include applying a photoresist layer to the second graphene layer and applying a protective layer to the photoresist layer. In some embodiments, the methods include applying a metallic plating to lamination stack. The methods further include drilling through the protective layer and at least one of a photoresist layer, the second graphene layer, the metal layer, the first graphene layer, and/or the core.