Patents by Inventor Simon A. Ward

Simon A. Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11588448
    Abstract: A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: February 21, 2023
    Assignee: Wolfspeed, Inc.
    Inventors: Madhu Chidurala, Richard Wilson, Haedong Jang, Simon Ward
  • Publication number: 20230000847
    Abstract: The invention provides compounds of the formula (I): (I) wherein A1, A2, R2, R4, B1, B2, X, X1, n, a and b are as defined are defined in the specification, to pharmaceutical compositions comprising the compounds and the compounds for use as medicaments. The compounds potentiate AMPA receptor function and are expected to be useful in the treatment of central nervous system disorders, for example in the treatment of depressive disorders, mood disorders and cognitive dysfunction associated with neuropsychiatric disorders such as schizophrenia.
    Type: Application
    Filed: March 4, 2022
    Publication date: January 5, 2023
    Inventors: Simon WARD, Paul BESWICK, Lewis PENNICOTT, Tristan REUILLON, Irina CHUCKOWREE, Carolina VILLALONGA-BARBER, Roderick Alan PORTER
  • Patent number: 11367696
    Abstract: RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: June 21, 2022
    Assignee: Wolfspeed, Inc.
    Inventors: Simon Ward, Richard Wilson, Alexander Komposch
  • Patent number: 11298345
    Abstract: The invention provides compounds of the formula (I): (I) wherein A1, A2, R2, R4, B1, B2, X, X1, n, a and b are as defined are defined in the specification, to pharmaceutical compositions comprising the compounds and the compounds for use as medicaments. The compounds potentiate AMPA receptor function and are expected to be useful in the treatment of central nervous system disorders, for example in the treatment of depressive disorders, mood disorders and cognitive dysfunction associated with neuropsychiatric disorders such as schizophrenia.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: April 12, 2022
    Assignee: University College Cardiff Consultants Limited
    Inventors: Simon Ward, Paul Beswick, Lewis Pennicott, Tristan Reuillon, Irina Chuckowree, Carolina Villalonga-Barber, Roderick Alan Porter
  • Patent number: 11257740
    Abstract: A device includes: a surface mount device carrier configured to be mounted to a metal submount of a transistor package, said surface mount device carrier includes an insulating substrate includes a top surface and a bottom surface and a first pad and a second pad arranged on a top surface of said surface mount device carrier; at least one surface mount device includes a first terminal and a second terminal, said first terminal of said surface mount device mounted to said first pad and said second terminal mounted to said second pad; and at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by said insulating substrate, where at least one of the first pad and the second pad are configured as wire bond pads.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: February 22, 2022
    Assignee: WOLFSPEED, INC.
    Inventors: Alexander Komposch, Simon Ward, Madhu Chidurala
  • Publication number: 20210408978
    Abstract: A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.
    Type: Application
    Filed: June 24, 2020
    Publication date: December 30, 2021
    Inventors: Madhu Chidurala, Richard Wilson, Haedong Jang, Simon Ward
  • Patent number: 11186567
    Abstract: The invention provides compounds of the formula (I): wherein R1 and R2 are defined in the specification, to pharmaceutical compositions comprising the compounds and the compounds for use as medicaments. The compounds potentiate AMPA receptor function and are expected to be useful in the treatment of central nervous system disorders, for example in the treatment of depressive disorders, mood disorders and cognitive dysfunction associated with neuropsychiatric disorders such as schizophrenia.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 30, 2021
    Assignee: University College Cardiff Consultants Limited
    Inventors: Simon Ward, Paul Beswick, Lewis Pennicott, Tristan Reuillon
  • Publication number: 20210280478
    Abstract: A radio frequency (RF) package includes a support having a semiconductor die attach region; a frame that includes an electrically insulative member having a lower side attached to the support and an upper side opposite the support; the frame includes an opening at least partially registered with said semiconductor die attach region; and the frame includes an upper metallization at the upper side of the electrically insulative member and a lower metallization The frame includes first electrically conductive edge connection connecting the first metallization to the first lower metallization.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 9, 2021
    Inventors: Richard Wilson, Haedong Jang, Simon Ward, Madhu Chidurala
  • Publication number: 20210265249
    Abstract: A device includes: a surface mount device carrier configured to be mounted to a metal submount of a transistor package, said surface mount device carrier includes an insulating substrate includes a top surface and a bottom surface and a first pad and a second pad arranged on a top surface of said surface mount device carrier; at least one surface mount device includes a first terminal and a second terminal, said first terminal of said surface mount device mounted to said first pad and said second terminal mounted to said second pad; and at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by said insulating substrate, where at least one of the first pad and the second pad are configured as wire bond pads.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Inventors: Alexander Komposch, Simon Ward, Madhu Chidurala
  • Publication number: 20210210444
    Abstract: RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 8, 2021
    Inventors: Simon Ward, Richard Wilson, Alexander Komposch
  • Patent number: 11031913
    Abstract: In integrating RF power amplifier circuits on a package, at least one bias voltage is coupled to at least one amplifier circuit on the package via two or more pins/connectors. In particular, at least one of a gate and drain bias voltage is coupled to one or more amplifier circuits via at least two pins/connectors. In some embodiments, the two or more bias voltage pins/connectors are connected together on the package, placing the pins/connectors in parallel, which reduces an inductance associated with the pins/connectors. In some embodiments, at least of the two pins/connectors connected to the same bias voltage are disposed on either side of an RF signal pin/conductor, simplifying the routing of signals on the package, affording greater flexibility of placement and routing on the package.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: June 8, 2021
    Assignee: Cree, Inc.
    Inventors: Madhu Chidurala, Marvin Marbell, Simon Ward
  • Publication number: 20210139463
    Abstract: The invention provides compounds of the formula (I): wherein R1 and R2 are defined in the specification, to pharmaceutical compositions comprising the compounds and the compounds for use as medicaments. The compounds potentiate AMPA receptor function and are expected to be useful in the treatment of central nervous system disorders, for example in the treatment of depressive disorders, mood disorders and cognitive dysfunction associated with neuropsychiatric disorders such as schizophrenia.
    Type: Application
    Filed: February 9, 2018
    Publication date: May 13, 2021
    Inventors: Simon Ward, Paul Beswick, Lewis Pennicott, Tristan Reuillon
  • Publication number: 20210113539
    Abstract: The invention provides compounds of the formula (I): (I) wherein A1, A2, R2, R4, B1, B2, X, X1, n, a and b are as defined are defined in the specification, to pharmaceutical compositions comprising the compounds and the compounds for use as medicaments. The compounds potentiate AMPA receptor function and are expected to be useful in the treatment of central nervous system disorders, for example in the treatment of depressive disorders, mood disorders and cognitive dysfunction associated with neuropsychiatric disorders such as schizophrenia.
    Type: Application
    Filed: March 1, 2019
    Publication date: April 22, 2021
    Inventors: Simon WARD, Paul BESWICK, Lewis PENNICOTT, Tristan REUILLON, Irina CHUCKOWREE, Carolina VILLALONGA-BARBER, Roderick Alan PORTER
  • Publication number: 20200366249
    Abstract: In integrating RF power amplifier circuits on a package, at least one bias voltage is coupled to at least one amplifier circuit on the package via two or more pins/connectors. In particular, at least one of a gate and drain bias voltage is coupled to one or more amplifier circuits via at least two pins/connectors. In some embodiments, the two or more bias voltage pins/connectors are connected together on the package, placing the pins/connectors in parallel, which reduces an inductance associated with the pins/connectors. In some embodiments, at least of the two pins/connectors connected to the same bias voltage are disposed on either side of an RF signal pin/conductor, simplifying the routing of signals on the package, affording greater flexibility of placement and routing on the package.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Inventors: Madhu Chidurala, Marvin Marbell, Simon Ward
  • Patent number: 10699063
    Abstract: This disclosure describes systems, methods, and computer program products for authoring content for digital books. In some implementations, a single graphical user interface (GUI) is presented that allows an author to design a layout for the digital book, including editing text and inserting various types of interactive elements in the text. The GUI functions as both a digital book layout design tool and a word processor to facilitate the building of a digital book. The relative page location of inserted widgets can be determined by a user-selectable anchor point placed within the text. An outline view of the digital book can be created and presented in the GUI based on a hierarchical structure determined by paragraph styles applied to the text. The GUI can provide a hybrid glossary and index page for allowing the author to create and manage a glossary and index for the digital book.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: June 30, 2020
    Assignee: Apple Inc.
    Inventors: Charles J. Migos, Diego Bauducco, Markus Hagele, Jay C. Capela, Gary W. Gehiere, Alexander C. MacLean, Jacob G. Refstrup, Christopher E. Rudolph, Peter W. Rapp, David M. Hall, Peter G. Berger, Simon A. Ward, Steven J. Israelson, Mark Ambachtsheer, Paul Elseth, Roger Rock Rosner, Yaniv Gur
  • Patent number: 10323021
    Abstract: Provided here in are compounds of Formula I having the structure: Also provided herein are compositions comprising compounds of Formula I and methods of using compounds of Formula I for the treatment of disorders, diseases or conditions mediated by GluN2B receptors.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 18, 2019
    Assignee: JANSSEN PHARMACEUTICALS, INC.
    Inventors: Rudolf Schindler, Hans-Joachim Lankau, Norbert Höfgen, Ute Egerland, Barbara Langen, Rita Dost, Simon Ward
  • Patent number: 10155727
    Abstract: The invention relates to pyrazole derivatives which are NMDA NR2B receptor inhibitors, useful in treating central nervous system diseases.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: December 18, 2018
    Assignee: JANSSEN PHARMACEUTICALS, INC.
    Inventors: Rudolf Schindler, Hans-Joachim Lankau, Norbert Höfgen, Christian Grunwald, Ute Egerland, Barbara Langen, Rita Dost, Thorsten Hage, Simon Ward
  • Patent number: 10106539
    Abstract: Benzimidazoles of formula (I): wherein: one of X and Y is an N atom or a substituted C atom, and the other is CH; L is a single bond, C1-3 alkylene, C2-3 alkenylene or C2-3 alkynylene; R1 is C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, 3- to 10-membered cycloalkyl, 5- to 10-membered heterocyclyl or 5- to 12-membered heteroaryl, each of which is unsubstituted or substituted; Z is halo, C1-6 haloalkyl, nitro, —CN, —N(R2)2, —OR2, —SR2, —S(=0)R2, or —S(=0)2R2; each R2 is independently hydrogen, C1-6 alkyl, C2-6 alkenyl or C2-6 alkynyl, wherein said alkyl, alkenyl and alkynyl groups are unsubstituted or substituted; and m is 0 or 1; and the pharmaceutically acceptable salt thereof are inhibitors of RSV and can therefore be used to treat or prevent an RSV infection.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: October 23, 2018
    Assignee: REVIRAL LIMITED
    Inventors: Stuart Cockerill, Neil Mathews, Simon Ward, Graham Lunn, Michael Paradowski, Jose Miguel Gascon Simorte
  • Publication number: 20180282305
    Abstract: Provided here in are compounds of Formula I having the structure: Also provided herein are compositions comprising compounds of Formula I and methods of using compounds of Formula I for the treatment of disorders, diseases or conditions mediated by GluN2B receptors.
    Type: Application
    Filed: April 27, 2018
    Publication date: October 4, 2018
    Inventors: Rudolf Schindler, Hans-Joachim Lankau, Norbert Höfgen, Ute Egerland, Barbara Langen, Rita Dost, Simon Ward
  • Patent number: RE49517
    Abstract: The invention relates to pyrazole derivatives which are NMDA NR2B receptor inhibitors, useful in treating central nervous system diseases.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: May 2, 2023
    Assignee: JANSSEN PHARMACEUTICALS, INC.
    Inventors: Rudolf Schindler, Hans-Joachim Lankau, Norbert Höfgen, Christian Grunwald, Ute Egerland, Barbara Langen, Rita Dost, Thorsten Hage, Simon Ward