Abstract: A device for identifying a shift in a point of interest (POI). The device may receive location information of the POI, determine a geographical coordinate of the POI based on the location information and using map data, determine a routable attribute of the POI based on the geographical coordinate and using updated map data, identify a shift in the POI between the map data and the updated map data based on an inconsistency between the routable attribute and the map data, determine an aggregate score based on the routable attribute and the inconsistency between the routable attribute and the map data when the shift in the POI is identified, and cause an action to be performed based on the aggregate score.

Abstract: A device for identifying a shift in a point of interest (POI) is provided. The device may receive location information of the POI, determine a geographical coordinate of the POI based on the location information and using map data, determine a routable attribute of the POI based on the geographical coordinate and using updated map data, identify a shift in the POI between the map data and the updated map data based on an inconsistency between the routable attribute and the map data, determine an aggregate score based on the routable attribute and the inconsistency between the routable attribute and the map data when the shift in the POI is identified, and cause an action to be performed based on the aggregate score.

Abstract: An interconnect structure for interconnecting an integrated circuit (IC) chip to a next level, a method of fabricating the interconnect at wafer level, and a method of interconnecting an integrated circuit (IC) chip to the next level. The interconnect structure comprises one or more planar micro-spring elements formed on a packaging surface of the chip and connected to an interconnection pad; wherein the interconnection pad is resiliently moveable horizontally and vertically with respect to the surface of the chip. A layer of solder is preferably electroplated onto the interconnection pad to provide interconnection to the next level. In a variation of the interconnect structure, a metal column is fabricated onto the interconnection pad prior to electroplating the solder layer.

Abstract: To detect an analyte, a fluid is flown through a filter. The fluid carries signal producing members smaller in size than the analyte and having affinity to specifically attach to the analyte. The filter is adapted for trapping the analyte while allowing passage of unattached ones of the signal producing members. A signal produced by one or more of the signal producing members can be sensed upstream of the filter to detect the analyte trapped by the filter.