Abstract: A method for evaluating a weld in a formed object includes performing a contact mechanics test of a first region that includes the weld and storing one or more corresponding weld surface mechanical property measurements, performing a contact mechanics test of a second region that excludes the weld and storing one or more corresponding base material surface mechanical property measurements, determining a relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements, determining one or more weld width measurements on the exterior surface of the formed object, and evaluating the weld based on the determined relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements in relation to the determined weld width measurements in order to provide an index of weld quality that is traditionally measured through a destructive test or examination.

Abstract: A material toughness testing apparatus includes a stylus having at least two cutting blades configured to engage with the sample and spaced apart to define a stretch passage therebetween and a stylus transport system configured to move the stylus along a path trajectory as the cutting blades cut the sample such that the sample is displaced on at least one side of the path trajectory. Each cutting blade has a blade dive surface and a blade lift surface that intersect to form a cutting edge configured to cut the sample along the path trajectory. Each blade dive surface and blade lift surface is configured to contact the sample when cutting the sample. The stylus is configured to separate the sample and configured to form a ligament in the stretch passage and to induce tension in the ligament due to opposing forces of the cutting blades and the sample.

Abstract: An apparatus for performing a contact mechanics test in a substrate includes a stylus having at least two contact elements. Each contact element has a contact profile, and the contact elements are disposed in the stylus to define a stretch passage therebetween. The stylus is configured to deform the substrate so as to cause the substrate to flow between the contact elements and induce tension in the substrate in order to generate and preserve micromodifications in the substrate. Methods of performing a contact mechanics test using the apparatus are also provided.

Abstract: An apparatus for performing a contact mechanics test by engaging multiple styluses with a substrate through a contact load that is applied by a load applicator and transferred to the styluses through a stylus load transfer mechanism. This apparatus allows the styluses to be positioned in close proximity to allow for a smaller and more compact apparatus, with less uncertainty on the magnitude of the engagement load being applied to each stylus. Ultimately, this provides a more portable apparatus for testing of material properties.

Abstract: An apparatus for performing a contact mechanics test in a substrate includes a stylus having at least two contact elements. Each contact element has a contact profile, and the contact elements are disposed in the stylus to define a stretch passage therebetween. The stylus is configured to deform the substrate so as to cause the substrate to flow between the contact elements and induce tension in the substrate in order to generate and preserve micromodifications in the substrate. Methods of performing a contact mechanics test using the apparatus are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.