Abstract: An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and around interior circuitry of the die, the inner ring having one or more gaps offset from the gaps of the outer ring. One or more conducting members are electrically isolated from said rings and electrically connected to the interior circuitry, each member passing through a gap of the inner ring and through a gap of the outer ring.

Abstract: An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and around interior circuitry of the die, the inner ring having one or more gaps offset from the gaps of the outer ring. One or more conducting members are electrically isolated from said rings and electrically connected to the interior circuitry, each member passing through a gap of the inner ring and through a gap of the outer ring.

Abstract: Techniques directed to realizing and verifying a logic model design are provided by first dividing the logic model design into two or more logic portions. The various model portions can then realized to form various realized logic portions. A first realized logic portion can then be wrapped and formally verified against its respective model. The wrapper can then be verified by first applying the wrapper to a second logic model portion and a second realized logic portion, then formally verifying them against each other. The resulting output can then be used to prove wrapper correctness.

Abstract: A method for designing multi-layer electronic circuits includes defining a plurality of circuit blocks in terms of physical boundaries, the plurality of circuit blocks including a first circuit block with at least one port for connecting to a portion of inter-block routing having conducting material external to the first circuit block. The method further provides protective routing for the at least one port of the first circuit block in a region between the block and the inter-block routing, wherein circuitry within the first circuit connected to the at least one port is not in-circuit with the conducting material of the inter-block routing during processing steps involving the conducting material. The protective routing is a conducting layer which is higher in the multi-layer structure than the highest conducting layer used for routing the net containing the at least one port for inter-block routing.

Abstract: A method for designing multi-layer electronic circuits includes defining a plurality of circuit blocks in terms of physical boundaries, the plurality of circuit blocks including a first circuit block with at least one port for connecting to a portion of inter-block routing having conducting material external to the first circuit block. The method further provides protective routing for the at least one port of the first circuit block in a region between the block and the inter-block routing, wherein circuitry within the first circuit connected to the at least one port is not in-circuit with the conducting material of the inter-block routing during processing steps involving the conducting material. The protective routing is a conducting layer which is higher in the multi-layer structure than the highest conducting layer used for routing the net containing the at least one port for inter-block routing.

Abstract: A method for designing multi-layer electronic circuits includes defining a plurality of circuit blocks in terms of physical boundaries, the plurality of circuit blocks including a first circuit block with at least one port for connecting to a portion of inter-block routing having conducting material external to the first circuit block. The method further provides protective routing for the at least one port of the first circuit block in a region between the block and the inter-block routing, wherein circuitry within the first circuit connected to the at least one port is not in-circuit with the conducting material of the inter-block routing during processing steps involving the conducting material. The protective routing is a conducting layer which is higher in the multi-layer structure than the highest conducting layer used for routing the net containing the at least one port for inter-block routing.

Abstract: Techniques directed to realizing and verifying a logic model design are provided by first dividing the logic model design into two or more logic portions. The various model portions can then realized to form various realized logic portions. A first realized logic portion can then be wrapped and formally verified against it's respective model. The wrapper can then be verified by first applying the wrapper to a second logic model portion and a second realized logic portion, then formally verifying them against each other. The resulting output can then be prove wrapper correctness.

Abstract: A method for designing multi-layer electronic circuits includes defining a plurality of circuit blocks in terms of physical boundaries, the plurality of circuit blocks including a first circuit block with at least one port for connecting to a portion of inter-block routing having conducting material external to the first circuit block. The method further provides protective routing for the at least one port of the first circuit block in a region between the block and the inter-block routing, wherein circuitry within the first circuit connected to the at least one port is not in-circuit with the conducting material of the inter-block routing during processing steps involving the conducting material. The protective routing is a conducting layer which is higher in the multi-layer structure than the highest conducting layer used for routing the net containing the at least one port for inter-block routing.