Abstract: An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.

Abstract: An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.

Abstract: A backplane power landing system having a backplane to which is attached extruded metal mounts on which are mounted compact power filter modules. The mounts are adapted to be conductively sealed, for the purpose of electromagnetic compatibility, to the backplane and have guidance slots to facilitate aligning the power filter modules which extend through openings in the central beam of the mount, to make contact with the backplane. The power filter modules are fastened to the mounts in a manner which maintains a conductive seal so as to deliver inputted power to the backplane filtered of radiated and conducted emission noise.

Abstract: A high density fiber optic connector interface for an electro-optic circuit pack is disclosed. The fiber optic connector interface comprises a elongated housing having an elongated base plate and side walls, a plurality of cable connection assemblies arrayed on the elongated base plate of the housing, and a plurality of slider mechanisms mounted on the elongated base plate. Each cable connection assembly is slanted relative to longitudinal axis of the housing. All the assemblies are arrayed in a row along a line slanted relative to longitudinal axis of the housing with the neighboring assemblies being overlapped. Each cable connection assembly includes an internal cable connector, an external cable connector, an adaptor for receiving the internal and external connectors, and an adaptor holder for holding at least one adaptor.

Abstract: A circuit pack handling system, comprising a handle assembly storage pocket formed in the sidewall of a circuit pack and a carrying handle assembly hinge-mounted within the pocket and adapted to retract substantially within the storage pocket. In a preferred embodiment, the system further comprises a handle locking sub-assembly affixed within the backplane end of the storage pocket between the inner wall of the pocket and the inner leg of the handle assembly to lock the handle assembly into the deployed position. In another preferred embodiment, the system further comprises a coil spring fitted at the gripping member hinge-joint of at least one of the legs so as to spring load the handle assembly whereby the handle assembly automatically flips out from the stored position inside the storage pocket to the deployed position as the circuit pack is pulled away from the shelf frame.

Abstract: A printed circuit board having a plurality of spaced apart scrap border support tabs along the perimeter. The board surfaces including the edges are coated with a conductive shielding material, except that each tab presents an uncoated, unshielded surface at the point of severance created by detachment of a scrap border subsequent to the coating application. The printed circuit board includes a plurality of spaced apart elongated apertures adjacent the perimeter, with each aperture being inwardly coincident to a respective one of each support tabs, each aperture defining an inner surface adjacent to the corresponding support tab with a portion of the inner surface being substantially parallel to adjacent perimeter portions of the circuit board, the inner surface of each aperture also being coated with the conductive shielding material with the latter being attached to the conductive shielding material of the board surface.