Patents by Inventor Simon Faiss

Simon Faiss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9627335
    Abstract: A method for processing a semiconductor device in accordance with various embodiments may include: depositing a first metallization layer over a semiconductor workpiece; patterning the first metallization layer; and depositing a second metallization layer over the patterned first metallization layer, wherein depositing the second metallization layer includes an electroless deposition process including immersing the patterned first metallization layer in a metal electrolyte.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: April 18, 2017
    Assignee: Infineon Technologies AG
    Inventors: Stephan Henneck, Evelyn Napetschnig, Daniel Pedone, Bernhard Weidgans, Simon Faiss, Ivan Nikitin
  • Publication number: 20150325535
    Abstract: A method for processing a semiconductor device in accordance with various embodiments may include: depositing a first metallization layer over a semiconductor workpiece; patterning the first metallization layer; and depositing a second metallization layer over the patterned first metallization layer, wherein depositing the second metallization layer includes an electroless deposition process including immersing the patterned first metallization layer in a metal electrolyte.
    Type: Application
    Filed: May 8, 2014
    Publication date: November 12, 2015
    Applicant: Infineon Technologies AG
    Inventors: Stephan HENNECK, Evelyn NAPETSCHNIG, Daniel PEDONE, Bernhard WEIDGANS, Simon FAISS, Ivan NIKITIN
  • Publication number: 20140242374
    Abstract: Various methods, apparatuses and devices relate to porous metal layers on a substrate which are three-dimensionally coated. In one embodiment, a porous metal layer is deposited over a substrate. The porous metal layer can be three-dimensionally coated with a coating material.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 28, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Johann Strasser, Thomas Kunstmann, Manfred Frank, Werner Robl, Maximilian Krug, Simon Faiss, Matthias Mueller