Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting electromagnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.

Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting magnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.

Abstract: A coupler is provided that includes a floating, exposed ground plane that can be partially removed to alter the coupling coefficient of the coupler's transmission lines. According to one embodiment, the coupler is formed using low temperature co-fired ceramic techniques to provide a small, stable and durable device suitable for installations in which miniaturization is required.

Abstract: An embodiment of the present invention provides a method of directional coupling, comprising utilizing the phase shift inherent in existing networks within an RF circuit to be monitored; and associating a plurality of capacitors and at least one termination resister with said RF circuit to enable said directional coupling. The plurality of capacitors may be three and said at least one termination resister may be one. In an embodiment of the present invention the RF circuit may be an impedance matching network or a filter.