Patents by Inventor Simon HOLZNER

Simon HOLZNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAVEGUIDE ANTENNA, RADAR SENSOR AND VEHICLE
    Publication number: 20260221663
    Abstract: A waveguide antenna, in particular for a radar sensor, including a radome, a waveguide, wherein the waveguide is at least partly formed by a recess in the radome, which recess at least partly has a metallization, and at least one radiating element is provided, which is arranged within the radome and extends from the waveguide, wherein the radiating element includes a non-metallized end face.
    Type: Application
    Filed: January 9, 2024
    Publication date: July 30, 2026
    Applicant: Continental Autonomous Mobility Germany GmbH
    Inventors: Johannes Kammerer, Jürgen Franz, Simon Holzner, Shilpa Cicy Saji
  • WAVEGUIDE ANTENNA, RADAR SENSOR AND VEHICLE
    Publication number: 20260211077
    Abstract: A waveguide antenna, in particular for a radar sensor is disclosed, including at least two adjacent radiator elements for transmitting and/or receiving signals. Each radiator element has a surrounding wall that forms a cavity. A central axis extends through the cavity, and the wall of at least one of the radiator elements is tilted relative to the central axis of the radiator element as viewed in a cross-section of the H-plane.
    Type: Application
    Filed: November 20, 2023
    Publication date: July 23, 2026
    Applicant: Continental Autonomous Mobility Germany GmbH
    Inventors: Johannes Kammerer, Richard Wedlich, Simon Holzner
  • Method for embedding electronics into a puck and puck having embedded electronics
    Patent number: 11458370
    Abstract: A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 4, 2022
    Assignee: KINEXON GMBH
    Inventors: Simon Holzner, Bernhard Johann Bohn
  • METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS
    Publication number: 20190308076
    Abstract: A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.
    Type: Application
    Filed: March 8, 2019
    Publication date: October 10, 2019
    Inventors: Simon HOLZNER, Bernhard Johann BOHN