Patents by Inventor Simon HOLZNER

Simon HOLZNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for embedding electronics into a puck and puck having embedded electronics
    Patent number: 11458370
    Abstract: A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 4, 2022
    Assignee: KINEXON GMBH
    Inventors: Simon Holzner, Bernhard Johann Bohn
  • METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS
    Publication number: 20190308076
    Abstract: A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.
    Type: Application
    Filed: March 8, 2019
    Publication date: October 10, 2019
    Inventors: Simon HOLZNER, Bernhard Johann BOHN