Abstract: A virtual robot image presentation method and an apparatus are provided to improve virtual robot utilization and user experience. In this method, an electronic device generates a first virtual robot image, and presents the first virtual robot image. The first virtual robot image is determined by the electronic device based on scene information. The scene information includes at least one piece of information in first information and second information, the first information is used to represent a current time attribute, and the second information is used to represent a type of an application currently running in the electronic device. According to the foregoing method, in a human-machine interaction process, virtual robot images can be richer and more vivid, so that user experience can be better, thereby improving virtual robot utilization of a user.

Abstract: Aspects of the present disclosure allow for improving E2E mesh throughput by applying transmission (TX) biasing on the Wi-Fi mesh backhaul. Aspects of the disclosure are directed to solutions for reducing traffic load in Wi-Fi mesh networks by applying TX biasing on the Wi-Fi mesh backhaul. Certain aspects are directed to selectively transmitting or preventing transmission of data over the first backhaul link to the first MLD based at least in part on a fronthaul airtime utilization, a first backhaul airtime utilization, or a second backhaul airtime utilization. Doing so allows a root access point or a network controller to apply TX biasing between multi-link operation links towards each repeater so that traffic load on a backhaul-link would not overly occupy the front-haul link because of common channel use by selectively transmitting or preventing transmission of data on the backhaul links.

Abstract: Computer-implemented method and system for receiving and processing one or more moment-associating elements. For example, the computer-implemented method includes receiving the one or more moment-associating elements, transforming the one or more moment-associating elements into one or more pieces of moment-associating information, and transmitting at least one piece of the one or more pieces of moment-associating information.

Abstract: Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a processing tool includes a processing chamber having a liner wall around a chamber volume, and a monitoring device having a sensor exposed to the chamber volume through a hole in the liner wall. The sensor is capable of measuring, in real-time, material deposition and removal rates occurring within the chamber volume during the wafer fabrication process. The monitoring device can be moved relative to the hole in the liner wall to selectively expose either the sensor or a blank area to the chamber volume through the hole. Accordingly, the wafer fabrication process being performed in the chamber volume may be monitored by the sensor, and the sensor may be sealed off from the chamber volume during an in-situ chamber cleaning process. Other embodiments are also described and claimed.

Abstract: Embodiments include a method of processing a substrate. In an embodiment, the method comprises flowing one or more source gasses into a processing chamber, and inducing a plasma from the source gases with a plasma source that is operated in a first mode. In an embodiment, the method may further comprise biasing the substrate with a DC power source that is operated in a second mode. In an embodiment, the method may further comprise depositing a film on the substrate.

Abstract: Embodiments include a method of processing a substrate. In an embodiment, the method comprises flowing one or more source gasses into a processing chamber, and inducing a plasma from the source gases with a plasma source that is operated in a first mode. In an embodiment, the method may further comprise biasing the substrate with a DC power source that is operated in a second mode. In an embodiment, the method may further comprise depositing a film on the substrate.

Abstract: Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a processing tool includes a processing chamber having a liner wall around a chamber volume, and a monitoring device having a sensor exposed to the chamber volume through a hole in the liner wall. The sensor is capable of measuring, in real-time, material deposition and removal rates occurring within the chamber volume during the wafer fabrication process. The monitoring device can be moved relative to the hole in the liner wall to selectively expose either the sensor or a blank area to the chamber volume through the hole. Accordingly, the wafer fabrication process being performed in the chamber volume may be monitored by the sensor, and the sensor may be sealed off from the chamber volume during an in-situ chamber cleaning process. Other embodiments are also described and claimed.

Abstract: Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a processing tool includes a processing chamber having a liner wall around a chamber volume, and a monitoring device having a sensor exposed to the chamber volume through a hole in the liner wall. The sensor is capable of measuring, in real-time, material deposition and removal rates occurring within the chamber volume during the wafer fabrication process. The monitoring device can be moved relative to the hole in the liner wall to selectively expose either the sensor or a blank area to the chamber volume through the hole. Accordingly, the wafer fabrication process being performed in the chamber volume may be monitored by the sensor, and the sensor may be sealed off from the chamber volume during an in-situ chamber cleaning process. Other embodiments are also described and claimed.

Abstract: Embodiments include a method of processing a substrate. In an embodiment, the method comprises flowing one or more source gasses into a processing chamber, and inducing a plasma from the source gases with a plasma source that is operated in a first mode. In an embodiment, the method may further comprise biasing the substrate with a DC power source that is operated in a second mode. In an embodiment, the method may further comprise depositing a film on the substrate.

Abstract: Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a processing tool includes a processing chamber having a liner wall around a chamber volume, and a monitoring device having a sensor exposed to the chamber volume through a hole in the liner wall. The sensor is capable of measuring, in real-time, material deposition and removal rates occurring within the chamber volume during the wafer fabrication process. The monitoring device can be moved relative to the hole in the liner wall to selectively expose either the sensor or a blank area to the chamber volume through the hole. Accordingly, the wafer fabrication process being performed in the chamber volume may be monitored by the sensor, and the sensor may be sealed off from the chamber volume during an in-situ chamber cleaning process. Other embodiments are also described and claimed.

Abstract: Embodiments include a method of processing a hardmask that includes forming an alloyed carbon hardmask over an underlying layer. In an embodiment, the alloyed carbon hardmask is alloyed with metallic-carbon fillers. The embodiment further includes patterning the alloyed carbon hardmask and transferring the pattern of the alloyed carbon hardmask into the underlying layer. According to an embodiment, the method may further include removing the metallic component of the metallic-carbon fillers from the alloyed carbon hardmask to form a porous carbon hardmask. Thereafter, the porous hardmask may be removed. In an embodiment, the metallic component of the metallic-carbon fillers may include flowing a processing gas into a chamber that volatizes the metallic component of the metallic-carbon fillers.

Abstract: Embodiments include a method of processing a hardmask that includes forming an alloyed carbon hardmask over an underlying layer. In an embodiment, the alloyed carbon hardmask is alloyed with metallic-carbon fillers. The embodiment further includes patterning the alloyed carbon hardmask and transferring the pattern of the alloyed carbon hardmask into the underlying layer. According to an embodiment, the method may further include removing the metallic component of the metallic-carbon fillers from the alloyed carbon hardmask to form a porous carbon hardmask. Thereafter, the porous hardmask may be removed. In an embodiment, the metallic component of the metallic-carbon fillers may include flowing a processing gas into a chamber that volatizes the metallic component of the metallic-carbon fillers.

Abstract: Embodiments include a method of processing a hardmask that includes forming an alloyed carbon hardmask over an underlying layer. In an embodiment, the alloyed carbon hardmask is alloyed with metallic-carbon fillers. The embodiment further includes patterning the alloyed carbon hardmask and transferring the pattern of the alloyed carbon hardmask into the underlying layer. According to an embodiment, the method may further include removing the metallic component of the metallic-carbon fillers from the alloyed carbon hardmask to form a porous carbon hardmask. Thereafter, the porous hardmask may be removed. In an embodiment, the metallic component of the metallic-carbon fillers may include flowing a processing gas into a chamber that volatizes the metallic component of the metallic-carbon fillers.

Abstract: The invention relates to a paper processing product and, in particular, to a shredder that crinkles paper stripes. The shredder has a shaft set driven by a motor. The shaft set includes at least two shafts rotating in opposite directions. Cutting blade sets are mounted on the shafts. Paper enters the entry of a paper passage formed by the shafts, and gets shredded into chips by the cutting blades. Since the exit of the paper passage is provided with a movable stopper, paper stripes are pushed by the rotating cutting blades to pass the stopper and become crinkled. The stopper is triggered to open by a certain force, letting the paper stripes fall. In addition to the functions of a usual shredder, the paper stripes thus made can be recycled.

Abstract: The invention relates to a paper processing product and, in particular, to a shredder that crinkles paper stripes. The shredder has a shaft set driven by a motor. The shaft set includes at least two shafts rotating in opposite directions. Cutting blade sets are mounted on the shafts. Paper enters the entry of a paper passage formed by the shafts, and gets shredded into chips by the cutting blades. Since the exit of the paper passage is provided with a movable stopper, paper stripes are pushed by the rotating cutting blades to pass the stopper and become crinkled. The stopper is triggered to open by a certain force, letting the paper stripes fall. In addition to the functions of a usual shredder, the paper stripes thus made can be recycled.

Abstract: A system for controlling the rotation speed of a shredder motor is disclosed. It consists of a bridge rectifier circuit, a forward/reverse controlling switch, a motor speed switch, and AC motor coils. By changing a switch, it is possible to activate the following four modes: forward fast, reverse fast, forward slow, and reverse slow. A user can thus operate a shredder at high torque and low rotation speed or high rotation speed and low torque depending on the number of sheets to be shredded.

Abstract: An expandable solid state drive is provided, comprising a main printed circuitboard, wherein the main printed circuitboard comprises a controller, an interface to a host, and connectors suitable to removably receive connectors mounted on a daughter card, the daughter card comprising at least one non-volatile flash memory chip, wherein when the daughter card is received by the main printed circuitboard, the form factor of the expandable solid state device is maintained.

Abstract: The present invention discloses a shredder which does not waste energy in standby mode. Power is applied to the components of the shredder only when material to be shredded is inserted into the shredder throat or when the unit is switched into reverse to clear a jam in the shredder.

Abstract: The present invention relates generally to shredder openings or throats. Specifically, this invention teaches a shredder housing with a top throat to allow material to be disposed of from above the shredder, as well as a side throat to allow for material to be disposed of from the side of the shredder. This is accomplished by placing a guiding member in the throat to assist both the top and side input. In addition, two side throats substantially opposite each other allow for multiple users to simultaneously use the shredder. Finally, the guiding member can serve as a handle to assist in lifting the housing from the base.

Abstract: A shredder holds a cutting blade assembly including a motor and a gear box inside its case and has a trash bin for collecting paper chips underneath the cutting blade assembly. A swinging board is provided in the vicinity of the paper outlet of the case. The swinging board is connected to a transmission axis via a shaft. One end of the transmission axis has a passive gear for receiving the rotating power from the cutting blade assembly via gears. As the transmission axis turns, the swinging board is driven by the shaft to perform a reciprocal motion so that the paper chips falling from the blades are evenly distributed over the trash bin. Paper chips accumulate in an even way to maximize the space in the trash bin. This prevents the formation of chip mountain and thus the problem of paper jams.