Abstract: This invention relates to a surgical irrigation system having an improved reusable, motorized console and a separable/attachable irrigation pump cassette, including, at least in one embodiment improved mechanical and electrical inner-connection structure therebetween, and at least in one embodiment improved pump priming structure and methods.

Abstract: A scalable fulfillment system is presented that supports business processes, manages the transport and processing of business-related messages or documents between a business entity and clients, such as customers, vendors, and business partners, and generally supports business document processing. The system intelligently manages the transportation of files from clients, through processing of files, to generating responses that return to the clients. To accommodate a heterogeneous interfacing and processing with different clients in a central system, a file normalization technique is used that captures a common meta-data format from the numerous heterogeneous file types used by numerous clients. The meta-data files, also referred to as messages, contain links to their associated data files and are processed separately.

Abstract: Increased sidewall coverage by a sputtered material is achieved by generating an ionizing plasma in a relatively low pressure sputtering gas. By reducing the pressure of the sputtering gas, it is believed that the ionization rate of the deposition material passing through the plasma is correspondingly reduced which in turn is believed to increase the sidewall coverage by the underlayer. Although the ionization rate is decreased, sufficient bottom coverage of the by the material is maintained. In an alternative embodiment, increased sidewall coverage by the material may be achieved even in a high density plasma chamber by generating the high density plasma only during an initial portion of the material deposition. Once good bottom coverage has been achieved, the RF power to the coil generating the high density plasma may be turned off entirely and the remainder of the deposition conducted without the high density plasma.

Abstract: Increased sidewall coverage by a sputtered material is achieved by generating an ionizing plasma in a relatively low pressure sputtering gas. By reducing the pressure of the sputtering gas, it is believed that the ionization rate of the deposition material passing through the plasma is correspondingly reduced which in turn is believed to increase the sidewall coverage by the underlayer. Although the ionization rate is decreased, sufficient bottom coverage of the by the material is maintained. In an alternative embodiment, increased sidewall coverage by the material may be achieved even in a high density plasma chamber by generating the high density plasma only during an initial portion of the material deposition. Once good bottom coverage has been achieved, the RF power to the coil generating the high density plasma may be turned off entirely and the remainder of the deposition conducted without the high density plasma.