Patents by Inventor Simon J. Damphousse

Simon J. Damphousse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6140698
    Abstract: A microwave integrated circuit package is disclosed. The package consists of a package substrate, having conductive vias, at least one ground plane, and conductive transmission lines; a semiconductor die electrically and mechanically connected to the top surface of the package substrate; a continuous outer wall attached to the top surface of the package substrate and at least one interior wall at a distance from a second wall, which may be the outer wall; a lid; at least one of the transmission lines passing under the interior wall and the second wall carrying a signal of frequency F; and an impedance transformer on the transmission line between the interior wall and the second wall. In operation, the interior wall, the distance between the interior wall and the second wall and the impedance transformer cancel the discontinuity caused by the second wall whereby the reflection of the signal caused by the transmission line passing under the walls is greatly diminished.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: October 31, 2000
    Assignee: Nortel Networks Corporation
    Inventors: Simon J. Damphousse, Tom Cameron, Ingrid M. Mag