Patents by Inventor Simon J. Mahon
Simon J. Mahon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10325850Abstract: An apparatus includes a laminate and a lid. The laminate generally includes a dielectric layer between a first conductive layer and a second conductive layer. The first conductive layer may include a probe configured to transfer a radio-frequency signal in a millimeter-wave band. The second conductive layer may be configured to provide a continuous ground plane parallel to the probe and separated from the probe by the dielectric layer. A plurality of channels may be (a) formed into a side of the second conductive layer opposite the dielectric layer, (b) formed to a depth less than a thickness of the second conductive layer, and (c) sized to permit gasses formed while securing the laminate to a substrate to escape from between the laminate and the substrate. The lid may be in contact with the first conductive layer.Type: GrantFiled: December 21, 2017Date of Patent: June 18, 2019Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Emmanuelle R. O. Convert, Ryan M. Clement, Simon J. Mahon, Leif G. M. Snygg
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Patent number: 10211780Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may have a first diode and a second diode connected as anti-parallel diodes and physically adjacent to each other in a substrate. The second circuit may have a third diode and a fourth diode connected as anti-parallel diodes and physically adjacent to each other in the substrate. The first circuit and the second circuit may be configured to mix two input signals to generate an output signal. A polarity of every other physically neighboring diode may be reversed.Type: GrantFiled: January 10, 2017Date of Patent: February 19, 2019Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Emmanuelle R. O. Convert, Simon J. Mahon, James T. Harvey
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Patent number: 9741666Abstract: An apparatus includes a package, a wall and a lid. The package may be configured to mount two chips configured to generate one or more signals in a millimeter-wave frequency range. The wall may be formed between the two chips. The wall generally has a plurality of conductive arches that attenuate an electromagnetic coupling between the two chips in the millimeter-wave frequency range. The lid may be configured to enclose the chips to form a cavity.Type: GrantFiled: October 25, 2016Date of Patent: August 22, 2017Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Emmanuelle R. O. Convert, Ryan M. Clement, Simon J. Mahon
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Publication number: 20170237399Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may have a first diode and a second diode connected as anti-parallel diodes and physically adjacent to each other in a substrate. The second circuit may have a third diode and a fourth diode connected as anti-parallel diodes and physically adjacent to each other in the substrate. The first circuit and the second circuit may be configured to mix two input signals to generate an output signal. A polarity of every other physically neighboring diode may be reversed.Type: ApplicationFiled: January 10, 2017Publication date: August 17, 2017Inventors: Emmanuelle R.O. Convert, Simon J. Mahon, James T. Harvey
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Patent number: 9614563Abstract: An apparatus includes a first receiver frequency conversion stage and a second receiver frequency conversion stage. The first receiver frequency conversion stage may be configured to generate at least four first intermediate frequency signals in response to a radio frequency (RF) input signal and respective phases of a first local oscillator signal. The second receiver frequency conversion stage may be configured to generate at least four output signals in response to the at least four first intermediate frequency signals and one or more phases of a second local oscillator signal. Each of the at least four output signals is generated in an independent channel in response to a respective one of the at least four first intermediate frequency signals and a respective one of the one or more phases of the second local oscillator signal.Type: GrantFiled: June 28, 2016Date of Patent: April 4, 2017Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Simon J. Mahon, James T. Harvey, Emmanuelle R. O. Convert
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Patent number: 9589949Abstract: An apparatus having a plurality of power pads of an integrated circuit, a plurality of transistors, and one or more diodes is disclosed. Each transistors may have a drain that forms a junction with a conductive layer of the integrated circuit. The diodes may be coupled between two of the power pads. A first portion less than all of an electro-static discharge that passes through a first of the two power pads and the conductive layer may be transferred through a first of the drains in a first of the transistors. A second portion less than all of the electro-static discharge may be transferred sequentially through (a) at least one of the diodes and (b) a second of the drains in a second of the transistors.Type: GrantFiled: October 16, 2014Date of Patent: March 7, 2017Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: James T. Harvey, Simon J. Mahon, Anna Dadello
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Patent number: 9571035Abstract: An apparatus includes a first circuit and a second circuit. The first circuit may be fabricated in a substrate and generally includes a first diode and a second diode (i) connected as anti-parallel diodes and (ii) physically adjacent to each other in the substrate. The second circuit may be fabricated in the substrate and generally includes a third diode and a fourth diode (i) connected as anti-parallel diodes and (ii) physically adjacent to each other in the substrate. The first circuit and the second circuit may be (a) connected in parallel, (b) physically adjacent to each other in the substrate and (c) configured to mix two input signals to generate an output signal.Type: GrantFiled: February 16, 2016Date of Patent: February 14, 2017Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Emmanuelle R. O. Convert, Simon J. Mahon, James T. Harvey
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Patent number: 9508658Abstract: An apparatus having a package, a wall and a lid is disclosed. The package may be configured to mount a plurality of chips. Two of the chips may generate a plurality of signals in a millimeter-wave frequency range. A metal is exposed at a surface of the package between the two chips. The metal is generally connected to an electrical ground. The wall may be formed on the metal and between the two chips. The wall generally has a plurality of arches that (i) are conductive, (ii) are wire bonded to the metal and (iii) attenuate an electromagnetic coupling between the two chips at the millimeter-wave frequency. The lid may be configured to enclose the chips to form a millimeter-wave cavity.Type: GrantFiled: September 9, 2015Date of Patent: November 29, 2016Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Emmanuelle R. O. Convert, Ryan M. Clement, Simon J. Mahon
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Publication number: 20160308565Abstract: An apparatus includes a first receiver frequency conversion stage and a second receiver frequency conversion stage. The first receiver frequency conversion stage may be configured to generate at least four first intermediate frequency signals in response to a radio frequency (RF) input signal and respective phases of a first local oscillator signal. The second receiver frequency conversion stage may be configured to generate at least four output signals in response to the at least four first intermediate frequency signals and one or more phases of a second local oscillator signal. Each of the at least four output signals is generated in an independent channel in response to a respective one of the at least four first intermediate frequency signals and a respective one of the one or more phases of the second local oscillator signal.Type: ApplicationFiled: June 28, 2016Publication date: October 20, 2016Inventors: Simon J. Mahon, James T. Harvey, Emmanuelle R.O. Convert
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Patent number: 9407205Abstract: An apparatus includes a first receiver and a second receiver. The first receiver may be configured to generate a plurality of first intermediate frequency signals in response to a radio frequency (RF) input signal and a first local oscillator signal. The second receiver may be configured to generate a plurality of output signals in response to the first intermediate frequency signals. Each of the output signals is generated in an independent channel in response to a respective one of the first intermediate frequency signals and a respective second local oscillator signal.Type: GrantFiled: December 23, 2014Date of Patent: August 2, 2016Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Simon J. Mahon, James T. Harvey, Emmanuelle R. O. Convert
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Publication number: 20160181982Abstract: An apparatus includes a first receiver and a second receiver. The first receiver may be configured to generate a plurality of first intermediate frequency signals in response to a radio frequency (RF) input signal and a first local oscillator signal. The second receiver may be configured to generate a plurality of output signals in response to the first intermediate frequency signals. Each of the output signals is generated in an independent channel in response to a respective one of the first intermediate frequency signals and a respective second local oscillator signal.Type: ApplicationFiled: December 23, 2014Publication date: June 23, 2016Inventors: Simon J. Mahon, James T. Harvey, Emmanuelle R.O. Convert
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Patent number: 8872190Abstract: A semiconductor device including a plurality of source pads, a plurality of drain fingers, a plurality of gate fingers, a drain combiner connected to the plurality of drain fingers, and a gate combiner connected to the plurality of gate fingers. The plurality of source pads generally comprises a pair of end source pads and one or more inner source pads. Each end source pad is configured to have added inductance. Each of the drain fingers is generally disposed between two of the plurality of source pads. Each of the gate fingers is generally disposed between a respective source pad and a respective drain finger.Type: GrantFiled: October 4, 2012Date of Patent: October 28, 2014Assignee: M/A-COM Technology Solutions Holdings, Inc.Inventors: Alan C. Young, Simon J. Mahon