Abstract: An electronic component enclosure comprises an outer frame and an inner frame, with the outer and inner frames forming a plenum therebetween. A cooling facility such as an HVAC unit is fluidly coupled to the electronic component enclosure's plenum. The cooling facility is controlled by a control system configured to adjust at least one property of fluid flowing through the plenum, such as its flow rate and/or temperature. Alternatively, a cooling system can comprise a plurality of electronic component enclosures such that a control system can be configured to adjust at least one property of fluid flowing through each electronic component enclosure's respective plenum.

Abstract: A method and apparatus for an electronic equipment enclosure that provides a frame and an enclosure surrounding the frame. One or more plenums may be arranged between the frame and enclosure and a heat exchanger may be mounted within the one or more plenums. The heat exchanger(s) may be water-based, glycol-based, refrigerant-based or based on other liquid mediums. The heat exchanger(s) may include multiple sets of fans and cooling elements, which may form a redundant cooling configuration. The heat exchanger(s) of one or more enclosures may be interconnected to a cooling controller that may control liquid-flow and air-flow rates within the one or more enclosures based on sensor signals provided to the cooling controller.

Abstract: A method and apparatus for an electronic equipment rack that provides mobility through directional self-propulsion and multi-axis suspension. The electronic equipment rack further provides self-powered operation and environmental control with wireless access, while protecting against unauthorized access, electromagnetic interference (EMI), and dust contamination. An alternate embodiment provides a non-mobile electronic equipment rack with multi-axis suspension, while optionally providing wireless access and protection against unauthorized access and the environment.