Patents by Inventor Simon J. S. McElrea
Simon J. S. McElrea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9824999Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: December 15, 2015Date of Patent: November 21, 2017Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Publication number: 20160218088Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: ApplicationFiled: March 31, 2016Publication date: July 28, 2016Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, JR.
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Publication number: 20160104689Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: ApplicationFiled: December 15, 2015Publication date: April 14, 2016Inventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Patent number: 9305862Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: GrantFiled: April 25, 2012Date of Patent: April 5, 2016Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, Jr.
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Patent number: 9252116Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: April 1, 2014Date of Patent: February 2, 2016Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Publication number: 20140213020Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: ApplicationFiled: April 1, 2014Publication date: July 31, 2014Applicant: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Patent number: 8742602Abstract: A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.Type: GrantFiled: March 12, 2008Date of Patent: June 3, 2014Assignee: Invensas CorporationInventors: Terrence Caskey, Lawrence Douglas Andrews, Jr., Scott McGrath, Simon J. S. McElrea, Yong Du, Mark Scott
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Patent number: 8723332Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: GrantFiled: May 20, 2008Date of Patent: May 13, 2014Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Lawrence Douglas Andrews, Jr., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Patent number: 8704379Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: August 27, 2008Date of Patent: April 22, 2014Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, DeAnn Eileen Melcher, Marc E. Robinson
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Patent number: 8680687Abstract: A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support.Type: GrantFiled: June 23, 2010Date of Patent: March 25, 2014Assignee: Invensas CorporationInventors: Reynaldo Co, Grant Villavicencio, Jeffrey S. Leal, Simon J. S. McElrea
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Patent number: 8629543Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: GrantFiled: October 27, 2010Date of Patent: January 14, 2014Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Lawrence Douglas Andrews, Jr., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Publication number: 20130099392Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: ApplicationFiled: April 25, 2012Publication date: April 25, 2013Applicant: VERTICAL CIRCUITS, INC.Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, JR.
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Patent number: 8324081Abstract: An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).Type: GrantFiled: March 4, 2011Date of Patent: December 4, 2012Inventors: Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, Jr., Weiping Pan, Grant Villavicencio, Yong Du, Scott Jay Crane, Zongrong Liu
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Patent number: 8178978Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: GrantFiled: March 12, 2009Date of Patent: May 15, 2012Assignee: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, Jr.
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Patent number: 8159053Abstract: A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.Type: GrantFiled: September 28, 2010Date of Patent: April 17, 2012Assignee: Vertical Circuits, Inc.Inventors: Lawrence Douglas Andrews, Jr., Jeffrey S. Leal, Simon J. S. McElrea
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Publication number: 20110272825Abstract: Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure.Type: ApplicationFiled: November 4, 2010Publication date: November 10, 2011Applicant: Vertical Circuits, Inc.Inventors: Scott McGrath, Jeffrey S. Leal, Ravi Shenoy, Loreto Cantillep, Simon J. S. McElrea, Suzette K. Pangrle
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Publication number: 20110147943Abstract: An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).Type: ApplicationFiled: March 4, 2011Publication date: June 23, 2011Applicant: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, JR., Weiping Pan, Grant Villavicencio, Yong Du, Scott Jay Crane, Zongrong Liu
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Patent number: 7923349Abstract: An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).Type: GrantFiled: June 19, 2008Date of Patent: April 12, 2011Assignee: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, Jr., Weiping Pan, Grant Villavicencio, Yong Du, Scott Jay Crane, Zongrong Liu
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Publication number: 20110037159Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: ApplicationFiled: October 27, 2010Publication date: February 17, 2011Applicant: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Publication number: 20110012246Abstract: A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.Type: ApplicationFiled: September 28, 2010Publication date: January 20, 2011Applicant: Vertical Circuits, Inc.Inventors: Lawrence Douglas Andrews, JR., Jeffrey S. Leal, Simon J.S. McElrea