Patents by Inventor Simon J. Shearman

Simon J. Shearman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12607815
    Abstract: A pluggable optical module, including: a body; a coldplate coupled to the body; and a pair of cooling fluid supply and return line quick disconnects coupled to the coldplate and extending from the coldplate and the body. Optionally, the coldplate is integrated into the body. Alternatively, the coldplate is coupled adjacent to an exterior surface of the body using one or more securement mechanisms, and a thermal interface material is disposed between the coldplate and the exterior surface of the body. The body and the coldplate are adapted to be inserted into a host card, circuit pack, or module as an integrated unit, with the pair of cooling fluid supply and return line quick disconnects adapted to fluidly engage a corresponding pair of cooling fluid supply and return line quick disconnects coupled to fluid supply and return manifolds or plenums disposed in the host card, circuit pack, or module.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: April 21, 2026
    Assignee: Ciena Corporation
    Inventors: Behzad Mohajer, Marko Nicolici, Peter Ajersch, Simon J. Shearman, Michael Bishop
  • Publication number: 20260059696
    Abstract: A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further defines an upper internal plenum and a lower internal plenum each coupled to one of the main inlet port and the plurality of cooling plate inlet ports and the main outlet port and the plurality of cooling plate outlet ports. Optionally, the upper internal plenum and the lower internal plenum each have a variable cross-sectional area along a length of the body between the main inlet port and the main outlet port.
    Type: Application
    Filed: July 18, 2025
    Publication date: February 26, 2026
    Inventors: Simon J. Shearman, Behzad Mohajer, Peter Ajersch
  • Patent number: 12543295
    Abstract: A hybrid air/liquid-cooled network element including a backplane defining a plurality of holes, one or more printed circuit boards disposed on one side of the backplane, a plurality of fan units coupled to an opposite side of the backplane and adapted to circulate an air flow to components disposed on the printed circuit board(s) through certain of the plurality of holes defined by the backplane, and one or more coolant distribution manifold boxes coupled to the opposite side of the backplane adjacent to the plurality of fan units and adapted to circulate a coolant fluid flow to one or more cold plates disposed adjacent to components disposed on the printed circuit board(s) through other of the plurality of holes defined by the backplane, where the one or more coolant distribution manifold boxes each have height and width dimensions substantially the same as each of the plurality of fan units.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: February 3, 2026
    Assignee: Ciena Corporation
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Patent number: 12419010
    Abstract: A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further defines an upper internal plenum and a lower internal plenum each coupled to one of the main inlet port and the plurality of cooling plate inlet ports and the main outlet port and the plurality of cooling plate outlet ports. Optionally, the upper internal plenum and the lower internal plenum each have a variable cross-sectional area along a length of the body between the main inlet port and the main outlet port.
    Type: Grant
    Filed: October 18, 2023
    Date of Patent: September 16, 2025
    Assignee: Ciena Corporation
    Inventors: Simon J. Shearman, Behzad Mohajer, Peter Ajersch
  • Patent number: 12388239
    Abstract: A network device includes a support structure configured to support communication equipment, the support structure including at least a non-conductive vertical substrate, a pair of conductive strips arranged on a front-facing surface of the non-conductive vertical substrate and configured in electrical communication with a power source, and one or more alignment blocks, where each of the one or more alignment blocks includes a touch-proof cage configuration that has spacing dimensions configured to prevent a normal-sized human finger from contacting the pair of conductive strips to reduce the risk of electric shock. Each of the one or more alignment blocks includes slots configured to guide one or more power connectors of a circuit board for making electrical contact with the pair of conductive strips when the circuit board is installed on the support structure.
    Type: Grant
    Filed: May 21, 2024
    Date of Patent: August 12, 2025
    Assignee: Ciena Corporation
    Inventors: Simon J. Shearman, Raymond Quintal, Jacques Cote, Daniel Rivaud
  • Publication number: 20250227887
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: March 26, 2025
    Publication date: July 10, 2025
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20250133691
    Abstract: A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further defines an upper internal plenum and a lower internal plenum each coupled to one of the main inlet port and the plurality of cooling plate inlet ports and the main outlet port and the plurality of cooling plate outlet ports. Optionally, the upper internal plenum and the lower internal plenum each have a variable cross-sectional area along a length of the body between the main inlet port and the main outlet port.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 24, 2025
    Inventors: Simon J. Shearman, Behzad Mohajer, Peter Ajersch
  • Publication number: 20250123454
    Abstract: A pluggable optical module, including: a body; a coldplate coupled to the body; and a pair of cooling fluid supply and return line quick disconnects coupled to the coldplate and extending from the coldplate and the body. Optionally, the coldplate is integrated into the body. Alternatively, the coldplate is coupled adjacent to an exterior surface of the body using one or more securement mechanisms, and a thermal interface material is disposed between the coldplate and the exterior surface of the body. The body and the coldplate are adapted to be inserted into a host card, circuit pack, or module as an integrated unit, with the pair of cooling fluid supply and return line quick disconnects adapted to fluidly engage a corresponding pair of cooling fluid supply and return line quick disconnects coupled to fluid supply and return manifolds or plenums disposed in the host card, circuit pack, or module.
    Type: Application
    Filed: February 5, 2024
    Publication date: April 17, 2025
    Inventors: Behzad Mohajer, Marko Nicolici, Peter Ajersch, Simon J. Shearman, Michael Bishop
  • Publication number: 20240305073
    Abstract: A network device includes a support structure configured to support communication equipment, the support structure including at least a non-conductive vertical substrate, a pair of conductive strips arranged on a front-facing surface of the non-conductive vertical substrate and configured in electrical communication with a power source, and one or more alignment blocks, where each of the one or more alignment blocks includes a touch-proof cage configuration that has spacing dimensions configured to prevent a normal-sized human finger from contacting the pair of conductive strips to reduce the risk of electric shock. Each of the one or more alignment blocks includes slots configured to guide one or more power connectors of a circuit board for making electrical contact with the pair of conductive strips when the circuit board is installed on the support structure.
    Type: Application
    Filed: May 21, 2024
    Publication date: September 12, 2024
    Inventors: Simon J. Shearman, Raymond Quintal, Jacques Cote, Daniel Rivaud
  • Patent number: 12021355
    Abstract: A network element incudes a shelf including a main backplane having a busbar system thereon, wherein the shelf supports any of port modules and switch modules, wherein the modules interconnect to one another via cables; extension brackets configured to connect to one of a top and a bottom of the shelf; and a power shelf configured to connect to the extension brackets, wherein the power shelf supports one or more power modules; wherein the power shelf is configured at a top of the shelf when the shelf is located, in any of a rack, frame, and cabinet, above another shelf, and wherein the power shelf is configured at a bottom of the shelf when the shelf is located below the another shelf.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: June 25, 2024
    Assignee: Ciena Corporation
    Inventors: Simon J. Shearman, Raymond Quintal, Jacques Cote, Daniel Rivaud
  • Patent number: 11980009
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: May 7, 2024
    Assignee: Ciena Corporation
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20240049434
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 8, 2024
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Patent number: 11796743
    Abstract: A pluggable module for use in a networking system includes a body with an electrical interface configured to be inserted into networking equipment; a head connected to the body and including a handle; and a light pipe with an entry in or near the body, the light pipe configured to provide light from inside the body to the handle. The body can include a light source directed towards the entry. The light source can be a Light Emitting Diode (LED). Advantageously, this disclosure provides an ability to support status lights in a very small surface area on a pluggable module.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: October 24, 2023
    Assignee: Ciena Corporation
    Inventors: Daniel Rivaud, Fabien Colton, Simon J. Shearman, Lloyd Cosman
  • Publication number: 20230039781
    Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
    Type: Application
    Filed: September 9, 2022
    Publication date: February 9, 2023
    Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
  • Publication number: 20230025753
    Abstract: A pluggable module for use in a networking system includes a body with an electrical interface configured to be inserted into networking equipment; a head connected to the body and including a handle; and a light pipe with an entry in or near the body, the light pipe configured to provide light from inside the body to the handle. The body can include a light source directed towards the entry. The light source can be a Light Emitting Diode (LED). Advantageously, this disclosure provides an ability to support status lights in a very small surface area on a pluggable module.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Inventors: Daniel Rivaud, Fabien Colton, Simon J. Shearman, Lloyd Cosman
  • Patent number: 11506845
    Abstract: Protection elements are provided for protecting optical networking systems during shipment. In one implementation, a system includes a card having one or more sockets, each socket having a connector device. The system also includes a pluggable module having an interface configured to connect with the connector device of a respective socket when the pluggable module is fully seated in the socket. A first protection element is configured to be held in place near a front edge of the socket. The first protection element is configured to allow the pluggable module to be arranged in a partially inserted position within the socket. Also, the first protection element is further configured to block the pluggable module from being fully seated in the socket to thereby prevent the interface of the pluggable module from contacting the connector device of the socket.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: November 22, 2022
    Assignee: Ciena Corporation
    Inventors: Daniel Rivaud, Fabien Colton, Simon J. Shearman, Lloyd Cosman
  • Publication number: 20220128772
    Abstract: Protection elements are provided for protecting optical networking systems during shipment. In one implementation, a system includes a card having one or more sockets, each socket having a connector device. The system also includes a pluggable module having an interface configured to connect with the connector device of a respective socket when the pluggable module is fully seated in the socket. A first protection element is configured to be held in place near a front edge of the socket. The first protection element is configured to allow the pluggable module to be arranged in a partially inserted position within the socket. Also, the first protection element is further configured to block the pluggable module from being fully seated in the socket to thereby prevent the interface of the pluggable module from contacting the connector device of the socket.
    Type: Application
    Filed: October 26, 2020
    Publication date: April 28, 2022
    Inventors: Daniel Rivaud, Fabien Colton, Simon J. Shearman, Lloyd Cosman
  • Publication number: 20220115856
    Abstract: Power supply systems are provided for carrying electrical power from a power source to a circuit board mounted on a housing, shelf, cabinet, etc. for supporting networking equipment. A busbar assembly, according to one embodiment, includes a pair of conductive strips configured to carry electrical power. The pair of conductive strips are arranged on a front-facing surface of a non-conductive vertical substrate. The busbar assembly further includes one or more alignment blocks configured to hold the pair of conductive strips in a fixed position with respect to the non-conductive vertical substrate. Each of the one or more alignment blocks is configured to guide a pair of power connectors of a circuit board for making electrical contact with the pair of conductive strips, while allowing simultaneous mating of signal connectors on the circuit board with signal connectors on the substrate, when the circuit board is being installed in a housing.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: Simon J. Shearman, Lloyd Cosman
  • Publication number: 20220115844
    Abstract: A network element incudes a shelf including a main backplane having a busbar system thereon, wherein the shelf supports any of port modules and switch modules, wherein the modules interconnect to one another via cables; extension brackets configured to connect to one of a top and a bottom of the shelf; and a power shelf configured to connect to the extension brackets, wherein the power shelf supports one or more power modules; wherein the power shelf is configured at a top of the shelf when the shelf is located, in any of a rack, frame, and cabinet, above another shelf, and wherein the power shelf is configured at a bottom of the shelf when the shelf is located below the another shelf.
    Type: Application
    Filed: September 20, 2021
    Publication date: April 14, 2022
    Inventors: Simon J. Shearman, Raymond Quintal, Jacques Cote, Daniel Rivaud
  • Patent number: 11303106
    Abstract: Power supply systems are provided for carrying electrical power from a power source to a circuit board mounted on a housing, shelf, cabinet, etc. for supporting networking equipment. A busbar assembly, according to one embodiment, includes a pair of conductive strips configured to carry electrical power. The pair of conductive strips are arranged on a front-facing surface of a non-conductive vertical substrate. The busbar assembly further includes one or more alignment blocks configured to hold the pair of conductive strips in a fixed position with respect to the non-conductive vertical substrate. Each of the one or more alignment blocks is configured to guide a pair of power connectors of a circuit board for making electrical contact with the pair of conductive strips, while allowing simultaneous mating of signal connectors on the circuit board with signal connectors on the substrate, when the circuit board is being installed in a housing.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: April 12, 2022
    Assignee: Ciena Corporation
    Inventors: Simon J. Shearman, Lloyd Cosman