Abstract: A method of calibrating a substrate transfer apparatus according to one or more embodiments may include: fixing a substrate transfer apparatus; measuring the operation of the fixed substrate transfer apparatus; generating eigendata relating to an operation of the fixed substrate transfer apparatus; and storing the eigendata in the substrate transfer apparatus.

Abstract: A particle removal system according to this disclosure includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles. The particle removal system includes a charger a robot, and a controller. The controller is configured to control operation of the robot to electrostatically charge the particle absorption tool so as to build up the static electric charge by using the charger.

Abstract: A particle removal system according to this disclosure includes a particle absorption tool configured to absorb particles, and a robot. The robot is configured to perform absorption operation that includes at least one of moving the particle absorption tool and pressing the particle absorption tool down in the target area in a target area for absorption of particles during the absorption of particles.

Abstract: A charging system according to this disclosure includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; a charger configured to electrostatically charge the particle absorption tool so as to build up the static electric charge; and a charger container configured to accommodate the charger, arranged in a place where a FOUP for accommodating substrates is arranged, and having an opening that is opened toward an interior of a substrate conveyor.

Abstract: A charging system according to this disclosure includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge.

Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.

Abstract: A substrate conveying robot includes an arm, a substrate holding hand, a sensor board to which a sensor is electrically connected, and a control board on which a controller is mounted, the control board including a universal connector connectable to different types of the sensor boards.

Abstract: An aligner system includes a motor, a rotating device, a control device, and a sensor. The motor generates a rotational drive force. The rotating device 11 is rotated by the rotational drive force generated by the motor, while supporting a wafer. The control device controls rotation of the rotating device, and performs a process of setting a rotational phase of the wafer to a predetermined value. The sensor emits a plurality of light beams traveling in different directions toward an edge of the wafer, and receives the light beams to detect a defect in the edge of the wafer.

Abstract: A substrate handling apparatus according to one or more embodiments may include: a base, an elevating unit that is connected to the base to freely elevate and lower, an arm that is rotatably connected to the elevating unit, a disk that is provided on the arm, and a hand that is rotatably connected to the arm, wherein in case that the hand is provided on a position to overlap the arm, the disk is provided under the substrate extracted by the hand.

Abstract: A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

Abstract: A substrate handling apparatus according to one or more embodiments may include: a base, an elevating unit that is connected to the base to freely elevate and lower, an arm that is rotatably connected to the elevating unit, a disk that is provided on the arm, and a hand that is rotatably connected to the arm, wherein in case that the hand is provided on a position to overlap the arm, the disk is provided under the substrate extracted by the hand.

Abstract: A robot system according to one or more embodiments may include a robot, and a control part. The robot may include one or more joints driven by an electric motor, and can hold a wafer by a holding part. The control part gives commands to the robot for control. When the robot holds and transports the wafer with the holding part, the control part performs, based on information about the electric motor, at least one of the following: determining whether slippage has occurred between the holding part and the wafer; and estimating an amount of slippage of the wafer relative to the holding part.

Abstract: A substrate conveying robot includes an arm, a substrate holding hand, a sensor board to which a sensor is electrically connected, and a control board on which a controller is mounted, the control board including a universal connector connectable to different types of the sensor boards.

Abstract: An aligner system includes a motor, a rotating device, a control device, and a sensor. The motor generates a rotational drive force. The rotating device 11 is rotated by the rotational drive force generated by the motor, while supporting a wafer. The control device controls rotation of the rotating device, and performs a process of setting a rotational phase of the wafer to a predetermined value. The sensor emits a plurality of light beams traveling in different directions toward an edge of the wafer, and receives the light beams to detect a defect in the edge of the wafer.

Abstract: Disclosed are techniques and systems for automatically determining and correcting the levelness of a wafer handling robot end effector. The systems may use a tilt sensor or a gravitational field sensor which may be calibrated to the wafer handling robot. The output from the tilt sensor may be used to determine or estimate the tilt of an end effector of the wafer handling robot and to perform correctional positioning to reduce or eliminate the tilt, to automatically teach certain positions that have reduced tilt, to perform health checks on the robot, provide feedback to a user, etc.

Abstract: A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.

Abstract: A robot system according to one or more embodiments may include a robot, and a control part. The robot may include one or more joints driven by an electric motor, and can hold a wafer by a holding part. The control part gives commands to the robot for control. When the robot holds and transports the wafer with the holding part, the control part performs, based on information about the electric motor, at least one of the following: determining whether slippage has occurred between the holding part and the wafer; and estimating an amount of slippage of the wafer relative to the holding part.

Abstract: A substrate transfer apparatus of the present invention includes: a robot including a hand configured to hold a substrate, and an arm configured to move the hand; a robot control device configured to set a moving path for the hand and control the arm such that the hand moves on the moving path toward a target position; and a camera disposed so as to be able to capture an image of the substrate held by the hand located at a predetermined confirmation position. The robot control device sets the moving path so as to pass through the confirmation position, obtains an image captured by the camera when the hand is located at the confirmation position, calculates a distance between a predetermined environment and the substrate which are taken in the image, and calculates a positional deviation amount from a reference position of the substrate on the basis of the distance.

Abstract: A substrate transfer apparatus of the present invention includes: a robot including a hand configured to hold a substrate, and an arm configured to move the hand; a robot control device configured to set a moving path for the hand and control the arm such that the hand moves on the moving path toward a target position; and a camera disposed so as to be able to capture an image of the substrate held by the hand located at a predetermined confirmation position. The robot control device sets the moving path so as to pass through the confirmation position, obtains an image captured by the camera when the hand is located at the confirmation position, calculates a distance between a predetermined environment and the substrate which are taken in the image, and calculates a positional deviation amount from a reference position of the substrate on the basis of the distance.