Abstract: A method for forming interconnects between a component and a substrate. The method comprises determining at least one location of differential flexing between a component and a substrate during drop impact; and forming a plurality of solder joints on at least one of the component and the substrate. A first number of the plurality of solder joints has a reduced amount of solder and a second number of the plurality of solder joints has normal solder content. The method also comprises conducting solder reflow of the plurality of solder joints to form interconnects between the component and the substrate. Those interconnects formed by the first number of solder joints have a reduced amount of solder forming an included angle with at least one of the component and the substrate. The included angle is large compared to an included angle between each of: the component and the substrate, and the second number of solder joints of normal solder content.