Abstract: A method to search for at least one relationship pattern in a plurality of runtime artifacts is provided. The method may include detecting at least one data manipulation statement in the plurality of runtime artifacts. The method may also include extracting at least one relationship clause from the detected at least one data manipulation statement. The method may further include parsing the extracted at least one relationship clause. The method may include generating at least one normalized syntax tree based on the parsed at least one relationship clause. The method may also include performing a classification and a snippet discovery on the generated at least one normalized syntax tree.

Abstract: A method and associated system. Entities within a first data source are identified. For each entity identified within the first data source, attributes of the entity identified within the first data source and/or relationships between the entity identified within the first data source and other entities identified within the first data source are identified. The attributes and/or relationships identified within the first data source are associated with a first entity identified within a data structure. For each entity identified within the first data source, a frequency metric characterizing the entity identified within the first data source is generated. The frequency metric is based on a frequency at which each attribute and/or relationship identified within the first data source is associated with the entity identified within the first data source. A degree of similarity between two entities of the entities is identified, by comparing the frequency metrics of the two entities.

Abstract: Techniques for provisioning access data may include receiving, by a first application installed on a communication device, user input selecting an account to provision to a second application installed on the communication device. The first application may invoke the second application and send a session identifier (ID) to the second application. The second application may send a user ID associated with the second application, a device ID, and the session ID to the first application. The first application may then generate encrypted provisioning request data and send the encrypted provisioning request data to the second application. The second application may send the encrypted provisioning request data to a remote server computer to request access data that can be used to access a resource. The second application may receive the access data provided by the remote server computer based on validation of the encrypted provisioning request data.

Abstract: A method for utilizing a registration authority to facilitate a certificate signing request is disclosed. In at least one embodiment, a registration authority computer may receive a certificate signing request associated with a token requestor. The registration authority may authenticate the identity of the token requestor and forward the certificate signing request to a certificate authority computer. A token requestor ID and a signed certificate may be provided by the certificate authority computer and forwarded to the token requestor. The token requestor ID may be utilized by the token requestor to generate digital signatures for subsequent token-based transactions.

Abstract: A requestor and a responder may conduct secure communication by making API calls based on a secure multi-party protocol. The requestor may send a request data packet sent in a API request to the responder, where the request data packet can include at least a control block that is asymmetrically encrypted and a data block that is symmetrically encrypted. The responder may return a response data packet to the requestor, where the response data packet can include at least a control block and a data block that are both symmetrically encrypted. The requestor and the responder may derive the keys for decrypting the encrypted portions of the request and response data packets based on some information only known to the requestor and the responder. The secure multi-party protocol forgoes the need to store and manage keys in a hardware security module.

Abstract: Systems and methods are provided for providing a more seamless purchasing experience using a mobile device. The mobile device acquires data, such a barcode image, an image of an object or text, or audio data. A non-limiting example of a barcode is a Quick Response (QR) barcode. The acquired data is then used to obtain a network address of a payment website or webpage, which allows a user to make a purchase for a given product or service. The mobile device then launches the payment website or webpage. A user can enter into the mobile device, through the payment website or webpage, a supplemental ID used for authenticating the transaction.

Abstract: Authentication systems and methods are provided for credential activation and/or provisioning. A transaction is made by a transaction processor to a user's credential account that contains a value and an activation code. The user retrieves the activation code from his or her account and provides it to the transaction processor. If the activation codes match, the credential may be activated.

Abstract: A method to search for at least one relationship pattern in a plurality of runtime artifacts is provided. The method may include detecting at least one data manipulation statement in the plurality of runtime artifacts. The method may also include extracting at least one relationship clause from the detected at least one data manipulation statement. The method may further include parsing the extracted at least one relationship clause. The method may include generating at least one normalized syntax tree based on the parsed at least one relationship clause. The method may also include performing a classification and a snippet discovery on the generated at least one normalized syntax tree.

Abstract: The present systems and methods provide for secured communication between a mobile device and a server/gateway. The systems and methods can be used, for example, as a way to confirm whether or not a transaction was actually authorized by the user, thereby settling a chargeback dispute for a previously executed transaction. The method comprises receiving the dispute regarding the transaction including associated transaction data, and retrieving a digital signature associated with the transaction data, the digital signature computed by signing the transaction data. The digital signature is then verified using a public key, wherein the public key corresponds to a private key stored on a mobile device. It is then determined whether or not the transaction is fraudulent based on a verification result of the digital signature.

Abstract: Systems and methods are provided for facilitating contactless payment using cloud-based wallet containing payment credentials (e.g. Visa, Mastercard, American Express) using a near field communication (NFC)-capable device and payment gateway servers. A user can use their existing payment card, herein referred to as a funding card, for contactless payments. A second payment card, herein referred to as a virtual card, is generated. The virtual card is associated with the funding card on a payment gateway server. The virtual card is used on a NFC-enabled mobile device. When a payment is initiated, the virtual card data is sent through the NFC system from a point of sale terminal. This information is sent to the payment gateway server, which retrieves the funding card to make the payment. The funding card, not the virtual card, is used to transfer the money to make payment.

Abstract: This invention discloses a through-silicon via (TSV) structure for providing an electrical path between a first-side surface and a second-side surface of a silicon chip, and a method for fabricating the structure. In one embodiment, the TSV structure comprises a via penetrated through the chip from the first-side surface to the second-side surface, providing a first end on the first-side surface and a second end on the second-side surface. A local isolation layer is deposited on the via's sidewall and on a portion of the first-side surface surrounding the first end. The TSV structure further comprises a plurality of substantially closely-packed microstructures arranged to form a substantially non-random pattern and fabricated on at least the portion of the first-side surface covered by the local isolation layer for promoting adhesion of the local isolation layer to the chip. A majority of the microstructures has a depth of at least 1 ?m.

Abstract: A multilayer microelectronic device package includes one or more vertical electrical contacts. At least one semiconductor material layer is provided having one or more electrical devices fabricated therein. An electrical contact pad can be formed on or in the semiconductor material layer. Another material layer is positioned adjacent to the semiconductor material layer and includes a conductive material stud embedded in or bonded to the layer. A via is formed through at least a portion of the semiconductor material layer and the electrical contact pad and into the adjacent layer conducting material stud. The via is constructed such that the via tip terminates within the conducting material stud, exposing the conducting material. A metallization layer is disposed in the via such that the metallization layer contacts both the electrical contact pad and the conducting material stud exposed by the via tip.

Abstract: The present invention provides a method for forming a three-dimensional wafer stack having a single metallized stack via with a variable cross-sectional shape. The method uses at least first and silicon wafers. Each wafer has one or more integrated circuits formed thereon. One or more through-vias are formed in each silicon wafer followed by oxide formation on at least an upper and lower surface of the silicon wafer. The wafers are aligned such that each wafer through via is aligned with a corresponding through via in adjacent stacked wafers. Wafers are bonded to form a three-dimensional wafer stack having one or more stack vias formed from the alignment of individual wafer vias. Via metallization is performed by depositing a seed layer in each of the stack vias followed by copper electroplating to form a continuous and homogeneous metallization path through the three-dimensional wafer stack.

Abstract: A user may claim to have not made or allowed a transaction and that the transaction was made in error. Where it appears the user has not authorized the transaction, the funds of the transaction are returned to the user, or are charged back. Systems and methods provide a way to confirm whether or not a transaction was actually authorized by the user, thereby settling a chargeback dispute for a previously executed transaction. The method comprises receiving the dispute regarding the transaction including associated transaction data, and retrieving a digital signature associated with the transaction data, the digital signature computed by signing the transaction data. The digital signature is then verified using a public key, wherein the public key corresponds to a private key stored on a mobile device. It is then determined whether or not the transaction is fraudulent based on a verification result of the digital signature.

Abstract: A user may claim to have not made or allowed a transaction and that the transaction was made in error. Where it appears the user has not authorized the transaction, the funds of the transaction are returned to the user, or are charged back. Systems and methods provide a way to confirm whether or not a transaction was actually authorized by the user, thereby settling a chargeback dispute for a previously executed transaction. The method comprises receiving the dispute regarding the transaction including associated transaction data, and retrieving a digital signature associated with the transaction data, the digital signature computed by signing the transaction data. The digital signature is then verified using a public key, wherein the public key corresponds to a private key stored on a mobile device. It is then determined whether or not the transaction is fraudulent based on a verification result of the digital signature.

Abstract: A first peer computer system operable in a peer to peer network, comprising: means for accessing a first piece of information, means for creating a first entity (e.g. a “token”), means for associating the first entity with the first piece of information (e.g. attaching the first piece of information to the entity) and wherein the first entity is associated with a topic of the information.

Abstract: A multilayer microelectronic device package includes one or more vertical electrical contacts. At least one semiconductor material layer is provided having one or more electrical devices fabricated therein. An electrical contact pad can be formed on or in the semiconductor material layer. Another material layer is positioned adjacent to the semiconductor material layer and includes a conductive material stud embedded in or bonded to the layer. A via is formed through at least a portion of the semiconductor material layer and the electrical contact pad and into the adjacent layer conducting material stud. The via is constructed such that the via tip terminates within the conducting material stud, exposing the conducting material. A metallization layer is disposed in the via such that the metallization layer contacts both the electrical contact pad and the conducting material stud exposed by the via tip.

Abstract: A system and method are provided for scheduling the payments of bills. An authorization server is provided to be in communication with one or more payment servers and a mobile device. The authorization server receives bills from a billing account, and each of the payment servers can make payments to the billing account. A mobile billing manager, residing on at least the mobile device, detects a new bill and then displays a graphical user interface (GUI) on the mobile device. Through the GUI, selection inputs are received, the selection inputs being associated with paying a first amount at a first date from a first payment account. Based on the payment schedule, the mobile billing manager, through the authorization server, instructs the payment server to make payments.

Abstract: High optical efficiency CMOS image sensors capable of sustaining pixel sizes less than 1.2 microns are provided. Due to high photodiode fill factors and efficient optical isolation, microlenses are unnecessary. Each sensor includes plural imaging pixels having a photodiode structure on a semiconductor substrate adjacent a light-incident upper surface of the image sensor. An optical isolation grid surrounds each photodiode structure and defines the pixel boundary. The optical isolation grid extends to a depth of at least the thickness of the photodiode structure and prevents incident light from penetrating through the incident pixel to an adjacent pixel. A positive diffusion plug vertically extends through a portion of the photodiode structure. A negative diffusion plug vertically extends into the semiconductor substrate for transferring charge generated in the photodiode to a charge collecting region within the semiconductor substrate.

Abstract: The present invention provides a method for forming a three-dimensional wafer stack having a single metallized stack via with a variable cross-sectional shape. The method uses at least first and silicon wafers. Each wafer has one or more integrated circuits formed thereon. One or more through-vias are formed in each silicon wafer followed by oxide formation on at least an upper and lower surface of the silicon wafer. The wafers are aligned such that each wafer through via is aligned with a corresponding through via in adjacent stacked wafers. Wafers are bonded to form a three-dimensional wafer stack having one or more stack vias formed from the alignment of individual wafer vias. Via metallization is performed by depositing a seed layer in each of the stack vias followed by copper electroplating to form a continuous and homogeneous metallization path through the three-dimensional wafer stack.