Abstract: Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.

Abstract: A flip chip ball grid array package is provided. In one embodiment, a flip chip ball grid array package comprises a substrate having an upper surface and a lower surface opposite the upper surface and a microelectronic element comprising a set of solder balls being secured to the upper surface of the substrate. A constraint member is secured to the lower surface of the substrate so that the constraint member has a degree of rigidity to reduce warpage due to thermal expansion mismatches between at least the microelectronic element and the substrate.

Abstract: Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.

Abstract: A flip chip ball grid array package is provided. In one embodiment, a flip chip ball grid array package comprises a substrate having an upper surface and a lower surface opposite the upper surface and a microelectronic element comprising a set of solder balls being secured to the upper surface of the substrate. A constraint member is secured to the lower surface of the substrate so that the constraint member has a degree of rigidity to reduce warpage due to thermal expansion mismatches between at least the microelectronic element and the substrate.

Abstract: A digital central control unit is connected in a master/slave relationship to a plurality of audio, video, and data components, at least one of which may be an analog component. A decoder digital-to-analog unit is positioned at the input of all analog components so that signals transmitted to them from the central control unit are not decoded and converted to analog signals until after the transmission has been completed. An encoder analog-to-digital unit for converting analog signals to digital signals is positioned at the output of each analog component so that their respective analog signals are in encoded digital format when being transmitted to the central control unit. The network is thus all-digital and is therefore not subject to the limitations of networks having analog transmission lines.

Abstract: A digital central control unit is connected in a master/slave relationship to a plurality of audio, video, and data components, at least one of which may be an analog component. A decoder digital-to-analog unit is positioned at the input of all analog components so that signals transmitted to them from the central control unit are not decoded and converted to analog signals until after the transmission has been completed. An encoder analog-to-digital unit for converting analog signals to digital signals is positioned at the output of each analog component so that their respective analog signals are in encoded digital format when being transmitted to the central control unit. The network is thus all-digital and is therefore not subject to the limitations of networks having analog transmission lines.