Patents by Inventor Simon M. Boardman

Simon M. Boardman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of printed circuit boards
    Patent number: 5035939
    Abstract: In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.
    Type: Grant
    Filed: February 9, 1990
    Date of Patent: July 30, 1991
    Assignee: David Sarnoff Research Center, Inc.
    Inventors: Edward J. Conlon, Ashok N. Prabhu, Simon M. Boardman, Valerie A. Pendrick
  • Thick film copper via-fill inks
    Patent number: 4810420
    Abstract: An improved copper via-fill ink for forming post-ups in a thick dielectric layer separating two patterned layers of copper conductor in a multilayer circuit assembly is provided. The via-fill ink comprises copper powder, a suitable organic vehicle and a glass frit consisting of a devitrifying glass and a vitreous glass. The devitrifying glass is a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass and the vitreous glass is a barium-calcium-borosilicate glass.
    Type: Grant
    Filed: October 2, 1986
    Date of Patent: March 7, 1989
    Assignee: General Electric Company
    Inventors: Ashok N. Prabhu, Kenneth W. Hang, Simon M. Boardman
  • Thick film resistor inks
    Patent number: 4479890
    Abstract: An improved ink composition suitable for the formation of thick film resistor inks which can be terminated directly to copper foil conductors. The subject compositions comprise an epoxy resin, conductive carbon particles, a suitable solvent and particulate alumina, wherein the alumina is present in an amount at least equal to the resin content on a weight basis.
    Type: Grant
    Filed: October 5, 1982
    Date of Patent: October 30, 1984
    Assignee: RCA Corporation
    Inventors: Ashok N. Prabhu, Simon M. Boardman