Abstract: A memory module includes an electronic printed circuit board with at least one contact strip, a plurality of integrated memory components, at least one first and one second buffer component, and a number of conductor tracks, which proceed from the contact strip and which are arranged on or in the printed circuit board. The conductor tracks include data lines, control lines and address lines. The conductor tracks lead from the contact strip to the buffer components or to one of the buffer components. The printed circuit board has conductor tracks that are interposed between the first buffer component and the second buffer component and that lead from the first buffer component to the second buffer component.

Abstract: A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.

Abstract: An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further comprising an integrated circuit with components and two half-sets of connection lines, the connection lines connecting the components of the integrated circuit to the pads, the integrated circuit further comprising a changeover device, the changeover device having two switching states in order to interchange the electrical assignment between the half-sets of the connection lines and the half-sets of the pads, and a carrier, the carrier comprising contact pieces. The chip is arranged on the carrier with one of the two main areas of the chip facing the carrier and the contact pieces of the carrier are connected to the pads of the chip, wherein one of the two switching states of the changeover device is selected, depending on which of the two main areas of the chip is the area facing the carrier.

Abstract: An integrated semiconductor memory device comprises: a receiver circuit for receiving a data signal, a receiver circuit for receiving a command signal, and a receiver circuit for receiving an address signal. A programmable storage unit comprises programmable elements. A current of the receiver circuits is controlled in dependence on a state of the programmable elements of the programmable storage unit. Depending on the application in which the integrated semiconductor memory device is used, the current of the receiver circuits is increased or decreased. By decreasing the current of the receiver circuits a dissipation loss of the integrated semiconductor memory device is reduced.

Abstract: An electronic system with integrated circuit device and passive component is disclosed. One embodiment provides a printed circuit board, a method for fabricating an electronic system, and an electronic system, including at least one integrated circuit device and at least one passive component, wherein the passive component is arranged at least partially underneath the integrated circuit device.

Abstract: Semiconductor memory modules and semiconductor memory systems using the same are described herein. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input lines and the rD signal output lines in a respective point-to-point fashion.

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension.

Abstract: A memory module comprises a printed circuit board with a main surface bounded by a first side and a second side, the first side being longer than the second side, a first and a second generally rectangular memory device each having a long side and a short side, the first and second memory devices positioned on the main surface of the printed circuit board in such a way that the first memory device long side is generally parallel to the printed circuit board first side and the second memory device long side is generally perpendicular to the printed circuit board first side, and a first set of passive components connected to the first memory device and a second set of passive components connected to the second memory device, the first and second sets of passive components positioned on the main surface of the printed circuit board between the first memory device and interconnection pads.

Abstract: A memory module includes an electronic printed circuit board with at least one contact strip, a plurality of integrated memory components, at least one first and one second buffer component, and a number of conductor tracks, which proceed from the contact strip and which are arranged on or in the printed circuit board. The conductor tracks include data lines, control lines and address lines. The conductor tracks lead from the contact strip to the buffer components or to one of the buffer components. The printed circuit board has conductor tracks that are interposed between the first buffer component and the second buffer component and that lead from the first buffer component to the second buffer component.

Abstract: The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components 10a and 10b arranged in a manner lying opposite on a substrate 2. The two semiconductor components 10a and 10b are in each case arranged with their chip contact-connection regions 11a and 11b facing the substrate 2. A vertical through-plating device 20 connects the two chip contact-connection regions 11a and 11b.

Abstract: A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.

Abstract: An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further comprising an integrated circuit with components and two half-sets of connection lines, the connection lines connecting the components of the integrated circuit to the pads, the integrated circuit further comprising a changeover device, the changeover device having two switching states in order to interchange the electrical assignment between the half-sets of the connection lines and the half-sets of the pads, and a carrier, the carrier comprising contact pieces. The chip is arranged on the carrier with one of the two main areas of the chip facing the carrier and the contact pieces of the carrier are connected to the pads of the chip, wherein one of the two switching states of the changeover device is selected, depending on which of the two main areas of the chip is the area facing the carrier.

Abstract: An integrated circuit assembly including an integrated circuit device electrically connected to a signal line, and method of making the same. The invention also includes a heat dissipation device thermally coupled to the integrated circuit device and a termination resistor electrically connected to the signal line and the heat dissipation device.

Abstract: A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.

Abstract: An integrated semiconductor memory device comprises: a receiver circuit for receiving a data signal, a receiver circuit for receiving a command signal, and a receiver circuit for receiving an address signal. A programmable storage unit comprises programmable elements. A current of the receiver circuits is controlled in dependence on a state of the programmable elements of the programmable storage unit. Depending on the application in which the integrated semiconductor memory device is used, the current of the receiver circuits is increased or decreased. By decreasing the current of the receiver circuits a dissipation loss of the integrated semiconductor memory device is reduced.

Abstract: A memory module device includes a printed circuit board, a plurality of memory modules and a buffer module. Lines are provided in or on the printed circuit board to connect the buffer module to the memory modules. The memory modules are combined at least partially to form memory module stacks.

Abstract: In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension.

Abstract: A semiconductor component package configuration includes a semiconductor chip mounted to a printed circuit board, and a substrate arranged between the semiconductor chip and the printed circuit board. The substrate is for routing the wiring terminals of the semiconductor chip to the printed circuit board. The substrate is connected to the printed circuit board by solder joints. A filler between the semiconductor chip and the substrate mechanically isolates the semiconductor chip and the solder joints. A metal layer, which is connected to solder joints, is applied to the substrate. At least one molded element of heat-dissipating material is applied to the metal layer and is connected in a heat-conducting manner to the metal layer. This provides the package configuration with an improved capability of conducting the lost power that is dissipated from the installed semiconductor chip, and the desired mechanical properties of the package arrangement are retained.

Abstract: The present invention includes a semiconductor memory modules and semiconductor memory systems using the same. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input linesand the rD signal output lines in a respective point-to-point fashion.

Abstract: A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.