Patents by Inventor Simon Peter Islinger

Simon Peter Islinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10027147
    Abstract: A holder configured to hold one or more components of a wireless charging power transfer system is provided. The apparatus comprises a first surface having one or more grooves configured to receive at least a portion of a conductor of a coil that spans the holder and at least one other holder, the coil configured to inductively transfer power via a magnetic field. The apparatus comprises one or more mechanical connectors configured to fasten the holder to the at least one other holder. The apparatus further comprises a plurality of transverse grooves on the first surface that extend in a direction substantially perpendicular to a direction of extension of the one or more grooves, the plurality of transverse grooves configured to guide the conductor of the coil from the holder to the at least one other holder.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: July 17, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Simon Peter Islinger, Steven Daniel Niederhauser
  • Publication number: 20170129344
    Abstract: Methods and apparatuses for thermal dissipation in vehicle pads for wireless power transfer applications are provided. In some implementations, an apparatus for wirelessly receiving charging power is provided. The apparatus comprises at least one receive coil configured to wirelessly receive the charging power. The apparatus further comprises a plurality of electrical components configured to convert the charging power to a direct current. The apparatus further comprises a primary heat sink comprising a plurality of fins configured to dissipate heat generated by the plurality of electrical components. The plurality of fins are disposed adjacent to the plurality of electrical components. The apparatus further comprises at least one thermally conductive structure configured to physically connect at least some of the plurality of electrical components to the primary heat sink.
    Type: Application
    Filed: November 6, 2015
    Publication date: May 11, 2017
    Inventors: Simon Peter Islinger, Steven Daniel Niederhauser, Jonathan Beaver, Chang-Yu Huang, Mickel Bipin Budhia, Nicholas Athol Keeling, Hao Hao, Michael Le Gallais Kissin, Rafal Krzysztof Scibor, Johan Gabriel Samuelsson
  • Patent number: 9583253
    Abstract: Systems and methods for implementing interengagement structures for a ferrite tile assembly of an induction coil housing are described herein. One aspect of the subject matter described in the disclosure is a housing. The housing includes a base forming a receptacle. The housing further includes a ferrite tile assembly. The housing further includes an interengagement structure extending from the base and configured to secure the ferrite tile assembly relative to the base within the receptacle.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: February 28, 2017
    Assignee: QUALCOMM Incorporated
    Inventor: Simon Peter Islinger
  • Publication number: 20160218534
    Abstract: A holder configured to hold one or more components of a wireless charging power transfer system is provided. The apparatus comprises a first surface having one or more grooves configured to receive at least a portion of a conductor of a coil that spans the holder and at least one other holder, the coil configured to inductively transfer power via a magnetic field. The apparatus comprises one or more mechanical connectors configured to fasten the holder to the at least one other holder. The apparatus further comprises a plurality of transverse grooves on the first surface that extend in a direction substantially perpendicular to a direction of extension of the one or more grooves, the plurality of transverse grooves configured to guide the conductor of the coil from the holder to the at least one other holder.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 28, 2016
    Inventors: Simon Peter Islinger, Steven Daniel Niederhauser
  • Publication number: 20150255205
    Abstract: Systems and methods for implementing interengagement structures for a ferrite tile assembly of an induction coil housing are described herein. One aspect of the subject matter described in the disclosure is a housing. The housing includes a base forming a receptacle. The housing further includes a ferrite tile assembly. The housing further includes an interengagement structure extending from the base and configured to secure the ferrite tile assembly relative to the base within the receptacle.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 10, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventor: Simon Peter Islinger