Patents by Inventor Simon-Pierre Pelletier

Simon-Pierre Pelletier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Portable suction device carrier for assembly processes
    Patent number: 11772280
    Abstract: Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: October 3, 2023
    Assignee: Ciena Corporation
    Inventors: Raphael Beaupré-Laflamme, Simon-Pierre Pelletier
  • Portable Suction Device Carrier for Assembly Processes
    Publication number: 20220362947
    Abstract: Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.
    Type: Application
    Filed: May 17, 2021
    Publication date: November 17, 2022
    Applicant: Ciena Corporation
    Inventors: Raphael Beaupré-Laflamme, Simon-Pierre Pelletier
  • Managing adhesive curing for photonic system assembly
    Patent number: 11500156
    Abstract: An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: November 15, 2022
    Assignee: Ciena Corporation
    Inventors: Daniel Asselin, Raphael Beaupré-Laflamme, Luc Belanger, Simon-Pierre Pelletier, Éric Giguère
  • Managing Adhesive Curing for Photonic System Assembly
    Publication number: 20220026637
    Abstract: An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 27, 2022
    Inventors: Daniel Asselin, Raphael Beaupré-Laflamme, Luc Belanger, Simon-Pierre Pelletier, Éric Giguère