Patents by Inventor Simon Rehn

Simon Rehn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11860001
    Abstract: The present disclosure relates to a sensor housing for a multi-parameter sensor, the sensor housing including: at least two connection points, wherein a first connection point is configured to receive a first sensor, and a second connection point is configured to receive a second sensor different from the first sensor, wherein the first connection point includes a first mistake-proofing feature for the first sensor, and the second connection point includes a second mistake-proofing feature for the second sensor, wherein the first and second mistake-proofing feature are configured such that only the first sensor can be inserted into the first connection point and only the second sensor can be inserted into the second connection point, respectively.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: January 2, 2024
    Assignee: Endress+Hauser Conducta GmbH+Co. KG
    Inventors: Axel Hänel, Christian Fanselow, André Pfeifer, Simon Rehn
  • Publication number: 20230184569
    Abstract: The present disclosure relates to a sensor housing for a multi-parameter sensor, the sensor housing including: at least two connection points, wherein a first connection point is configured to receive a first sensor, and a second connection point is configured to receive a second sensor different from the first sensor, wherein the first connection point includes a first mistake-proofing feature for the first sensor, and the second connection point includes a second mistake-proofing feature for the second sensor, wherein the first and second mistake-proofing feature are configured such that only the first sensor can be inserted into the first connection point and only the second sensor can be inserted into the second connection point, respectively.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 15, 2023
    Inventors: Axel Hänel, Christian Fanselow, André Pfeifer, Simon Rehn