Abstract: The present disclosure relates to a kitchen appliance for heating foodstuffs with a wall. A heating conductor for heating foodstuffs is present in the wall. The wall comprises an outer first layer. A second layer of the wall is optionally located between the first layer and the heating conductor. The thermal conductivity of the second layer is greater than the thermal conductivity of the first layer. A first temperature sensor is present in the wall, which contacts the first layer. A second temperature sensor is present in the wall, which is optionally arranged separately from the first layer. It may be sufficient that the first temperature sensor has a large distance, and the second temperature sensor has a small distance to heating conductor tracks. The disclosure also relates to a method for manufacturing the kitchen appliance wherein the first temperature sensor and the second temperature sensor are calibrated. By means of the kitchen appliance target temperatures can be set very precisely.

Abstract: A flat no-leads package, the flat no-leads package includes a leadframe for electrically connecting an integrated circuit (IC) chip which in a mounted configuration is arranged in a center portion of the flat no-leads package. The leadframe has at least one RF lead pin; and an isolating encapsulation which is at least partially encapsulating the leadframe such that contact surfaces of the leadframe are electrically contactable at least from a bottom side of the flat no-leads package; wherein at least one of the RF lead pin has a first and second contact surfaces. A cross-section of the RF lead pin increases from the first contact surface to the second contact surface both in a horizontal direction and in a direction vertical thereto. Further, a printed circuit board having a flat no-leads package and a measurement device having a flat no-leads package are provided.

Abstract: A flat no-leads package, the flat no-leads package includes a leadframe for electrically connecting an integrated circuit (IC) chip which in a mounted configuration is arranged in a center portion of the flat no-leads package, The leadframe has at least one RF lead pin; and an isolating encapsulation which is at least partially encapsulating the leadframe such that contact surfaces of the leadframe are electrically contactable at least from a bottom side of the flat no-leads package; wherein at least one of the RF lead pin has a first and second contact surfaces. A cross-section of the RF lead pin increases from the first contact surface to the second contact surface both in a horizontal direction and in a direction vertical thereto. Further, a printed circuit board having a flat no-leads package and a measurement device having a flat no-leads package are provided.