Patents by Inventor Simon S. Ang

Simon S. Ang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11569815
    Abstract: A rectangular power module with a body having two short ends defining a length and two long sides defining a width having three parallel circuit paths crossing the short width distance from side to side using side positioned gate terminals and planar top positioned top power terminal positioned between MOSFETS in the circuit for even thermal positioning and reduced current path, inductance, and resistance and increased power density.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: January 31, 2023
    Inventors: Zhong Chen, Simon S. Ang, Junji Ke
  • Publication number: 20090078300
    Abstract: The present system and method provides a maximum power point tracking converter for use with a solar cell group in a distributed manner within a solar panel. According to one embodiment, one or more solar cells within a solar panel are grouped and coupled to a distributed converter that extracts maximum power from the coupled solar cell group.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 26, 2009
    Inventors: Simon S. Ang, Keith C. Burgers
  • Patent number: 6462976
    Abstract: The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: October 8, 2002
    Assignee: University of Arkansas
    Inventors: Kraig J. Olejniczak, Keith C. Burgers, Simon S. Ang, Errol V Porter