Abstract: An apparatus including first and second substrates. The first and second substrates each include a base and at least one peripheral wall extending from the base. One of the at least one peripheral walls of the first or second substrates includes at least one well, and the other of the at least one peripheral walls of the first or the seconds substrate that does not include a well is mechanically anchored to the well. The apparatus includes a stack having a first and second end, and the stack is disposed on the base of the first and/or the second substrates at the first and/or second ends. The stack includes at least one element configured to generate energy. A method of assembling the apparatus by contacting the substrates.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: At least a portion of an integrated circuit wafer includes at least one layer in which two or more waveguides are formed. A cavity is formed in the integrated circuit wafer. At least one die, comprising a photonic integrated circuit, has: at least one edge on which there are two or more optical mode defining structures in proximity to respective optical mode defining structures on at least one surface of the cavity, a bottom surface secured to a bottom surface of the cavity, and a top surface on which there is at least one metal contact.

Abstract: At least a portion of an integrated circuit wafer includes at least one layer in which two or more waveguides are formed. A cavity is formed in the integrated circuit wafer. At least one die, comprising a photonic integrated circuit, has: at least one edge on which there are two or more optical mode defining structures in proximity to respective optical mode defining structures on at least one surface of the cavity, a bottom surface secured to a bottom surface of the cavity, and a top surface on which there is at least one metal contact.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component includes a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool, b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon, c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon; and d) breaking tails of the two wires near the second bond connection.

Abstract: A power efficient assembly is provided for applying a temperature gradient to a Fiber Bragg grating. The assembly includes inner and outer enclosures, the outer enclosure defining an insulation chamber around the inner enclosure. The respective ends of the inner and outer enclosures are in thermal contact. A heat exchange system, such as coiled resistive wires or thermo-electric coolers, applies different temperatures to the opposite ends of the outer enclosure.

Abstract: A power efficient assembly is provided for applying a temperature gradient to a Fiber Bragg grating. The assembly includes inner and outer enclosures, the outer enclosure defining an insulation chamber around the inner enclosure. The respective ends of the inner and outer enclosures are in thermal contact. A heat exchange system, such as coiled resistive wires or thermo-electric coolers, applies different temperatures to the opposite ends of the outer enclosure.

Abstract: A colorless tunable dispersion compensator for compensating for chromatic dispersion in a multi-channel light signal is provided. The compensator includes a multi-channel Bragg grating extending along a waveguide. Dispersion tuning means, such as a temperature gradient inducing device, are provided for tuning the dispersion characteristics of the wavelength channels. Wavelength shifting means are also provided for uniformly shifting the central wavelengths of all channels independently of their dispersion characteristics. A uniform temperature inducing or strain applying assembly can be used for this purpose.

Abstract: A method for aligning the spectral responses of two comb-like optical filters is provided. This method does not necessitate the use of spectrally-resolved equipment, as it uses the optical power correlation profile of a broadband light signal representative of the combined spectral responses of the two filters. In one embodiment, the power correlation profile is compared to a pre-stored profile. A tuning method for tuning two filters using this alignment method is also provided. The two filters are first relaxed to an unstretched position, and the second filter is stretched and aligned with the first. The first filter is also stretched and aligned with the other. Both filters are then stretched at a calibrated value.

Abstract: A method for aligning the spectral responses of two comb-like optical filters is provided. This method does not necessitate the use of spectrally-resolved equipment, as it uses the optical power correlation profile of a broadband light signal representative of the combined spectral responses of the two filters. In one embodiment, the power correlation profile is compared to a pre-stored profile. A tuning method for tuning two filters using this alignment method is also provided. The two filters are first relaxed to an unstretched position, and the second filter is stretched and aligned with the first. The first filter is also stretched and aligned with the other. Both filters are then stretched at a calibrated value.