Patents by Inventor Simon Sebanz

Simon Sebanz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200053864
    Abstract: A method of manufacturing a printed circuit board or a subassembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Simon Sebanz, Hannes Voraberger
  • Patent number: 10492288
    Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: November 26, 2019
    Assignee: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Simon Sebanz, Hannes Voraberger
  • Publication number: 20180042099
    Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.
    Type: Application
    Filed: October 16, 2017
    Publication date: February 8, 2018
    Applicant: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
    Inventors: Simon Sebanz, Hannes Voraberger
  • Patent number: 9795025
    Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof by coupling at least two elements of insulating materials with different properties on adjacent side surfaces and covering the elements with a layer of conductive material and building up at least one further layer at least partly overlapping the at least two elements.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: October 17, 2017
    Assignee: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Simon Sebanz, Hannes Voraberger
  • Publication number: 20140216792
    Abstract: A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps: providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material. Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.
    Type: Application
    Filed: July 12, 2012
    Publication date: August 7, 2014
    Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Simon Sebanz, Hannes Voraberger, Richard McConnell, Luis Chau
  • Publication number: 20140216793
    Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements of insulating material coupling or connecting the elements of insulating material on at least one adjacent side surface covering the elements of insulating material with a layer of conductive material on at least one surface building up at least one further layer of the printed circuit board at least partly on the elements of insulating material, wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board or sub-assembly thereof is provided.
    Type: Application
    Filed: July 12, 2012
    Publication date: August 7, 2014
    Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Simon Sebanz, Hannes Voraberger