Patents by Inventor Simon Sihua Wen

Simon Sihua Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dimple array interconnect technique for semiconductor device
    Publication number: 20020030276
    Abstract: A conductive layer having a plurality dimples is provided for interconnecting a power device chip and a driver circuit for driving and controlling the power device chip within a power module. A plurality of concave-shaped dimples of the conductive layer form an electrical contact with the power device chip, and at least one convex-shaped dimple of the conductive layer forms an electrical contact with the driver circuit. Optionally, a group of through-holes are formed around each of the dimples.
    Type: Application
    Filed: April 11, 2001
    Publication date: March 14, 2002
    Inventors: Guo-Quan Lu, Simon Sihua Wen