Abstract: The present invention refers to a method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, wherein the method comprises the steps of providing an intermediate circuit comprising the NFC chip connected the sensor, for instance a biosensor, and of providing a single side inlay comprising a substrate and the antenna. Afterwards, the intermediate circuit and the single side inlay are mated together so as to connect the NFC chip to the antenna. The present invention also refers to the integrated circuit or tag produced according to this method.

Abstract: The present invention relates to a moisture sensor comprising a support substrate having a first face and a second face, geometrically opposite to the first face, and wherein: the first face is provided with a plurality of pairs of electrodes configured to be in contact with a liquid, and the second face comprises a plurality of means of detection connected to each other in parallel, and each means of detection comprises a transistor associated to a pair of electrodes, and the moisture sensor is sensitive to an equivalent resistance of the plurality of means of detection.

Abstract: A process for manufacturing a sensor including at least two electrodes, including providing a flexible dielectric substrate having a layer of electrically conductive material on at least one of its sides. The electrodes, conductive connecting tracks and a common current supply track are etched in the layer of electrically conductive material. The process further includes electrodepositing one or more layers on the two electrodes and a step of selectively depositing, electrochemically, on at least one electrode, at least one layer of a material different from the one or more materials already deposited on another electrode.

Abstract: The invention relates to an electrical circuit, for example of the printed circuit type, for producing a module intended to be integrated into a chip card. This module has electrical contact—or connector—areas for the connection and communication of the chip to and with a read/write system. In order to give them a different colour from the gilded or silvered ones generally used, these electrical contact areas are at least partially covered with a surface layer comprising a compound of XpOqNrCs type, in which X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, with p, q>0 and r?0 and/or s?0. The invention also relates to a method for manufacturing such an electrical circuit.

Abstract: Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

Abstract: The present invention provides a sensing system, a smart wearing arrangement and a method of fabricating a sensing system. In accordance with illustrative embodiments, the sensing system comprises: a flexible substrate, at least one sensor device, a chip device, and at least one electrical line, the at least one electrical line electrically connecting the chip device and the at least one sensor device. Herein, the at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate.

Abstract: The present invention concerns a multilayer structure for a biosensor, comprising a base layer, a biocompatible layer comprising a reagent on the base layer, a self-adhesive layer on the biocompatible layer, such that the reagent is at least partially aligned with a channel formed in the self-adhesive layer, and a top layer on the self-adhesive layer. According to the present invention, the biocompatible layer is deposited directly onto the base layer and is adhesive. The present invention also concerns a biosensor and a method for the manufacture of such a multilayer structure.

Abstract: Process for producing bands for biological measurements on the basis of flexible circuits on a carrier strip, provided with a flexible insulating substrate provided, on at least one of its faces, with conductive tracks, contact pads and electrodes, includes the application, to said face, of masking means leaving the contact pads and/or the electrodes of the band visible and the selective deposition of a layer of noble metal on said contact pads and electrodes through said masking means.

Abstract: Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.