Abstract: A radio frequency (RF) package includes a support having a semiconductor die attach region; a frame that includes an electrically insulative member having a lower side attached to the support and an upper side opposite the support; the frame includes an opening at least partially registered with said semiconductor die attach region; and the frame includes an upper metallization at the upper side of the electrically insulative member and a lower metallization The frame includes first electrically conductive edge connection connecting the first metallization to the first lower metallization.

Abstract: A nozzle, such as a nozzle for use as a part of a beverage preparation package. The nozzle may include a nozzle body with a conduit, the conduit having an inlet end and an outlet end. The nozzle may also include a plug that is connected to the nozzle body in a detachable manner. The plug and the conduit may be configured such that, when the plug is detached from the nozzle body, the plug is adapted to travel along the conduit and be retained within the conduit at the outlet end such that fluid can flow through the conduit from the inlet end towards the outlet end.

Abstract: A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

Abstract: A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

Abstract: A nozzle, such as a nozzle for use as a part of a beverage preparation package. The nozzle may include a nozzle body with a conduit, the conduit having an inlet end and an outlet end. The nozzle may also include a plug that is connected to the nozzle body in a detachable manner. The plug and the conduit may be configured such that, when the plug is detached from the nozzle body, the plug is adapted to travel along the conduit and be retained within the conduit at the outlet end such that fluid can flow through the conduit from the inlet end towards the outlet end.

Abstract: The present invention relates to a nozzle (240). In particular, a nozzle for use as part of a beverage preparation package. The nozzle comprises a nozzle body (246) with a conduit (242), the conduit having an inlet end (254) and an outlet end (256), and a plug (248) that is connected to the nozzle body in a detachable manner. The plug and the conduit are configured such that, when the plug is detached from the nozzle body, the plug is adapted to travel along the conduit and be retained within the conduit at the outlet end such that fluid can flow through the conduit from the inlet end towards the outlet end.

Abstract: The present invention relates to a nozzle (240). In particular, a nozzle for use as part of a beverage preparation package. The nozzle comprises a nozzle body (246) with a conduit (242), the conduit having an inlet end (254) and an outlet end (256), and a plug (248) that is connected to the nozzle body in a detachable manner. The plug and the conduit are configured such that, when the plug is detached from the nozzle body, the plug is adapted to travel along the conduit and be retained within the conduit at the outlet end such that fluid can flow through the conduit from the inlet end towards the outlet end.

Abstract: Extrusion of feed materials of a high temperature formable non-ferrous metal susceptible to embrittlement during air processing uses an extrusion system having a rotatable wheel and shoe covering part of the length of a groove around the periphery of the wheel to form an arcuate passageway, the shoe having an abutment which substantially closes a second end of the passageway and an extrusion die spaced from the abutment by a die chamber. The process includes pre-heating the feed material to not less than about 390° C. in a chamber defined by a feeder device, maintaining a protective atmosphere in the chamber of the feeder device while the feed material is heated. The pre-heated feed material then is passed to an inlet end of the passageway, and drawn along the passageway, to be forced by the abutment into the die chamber and through an extrusion orifice of the die to provide extruded product.

Abstract: A method and a system for balancing rental fleet of movable assets are provided. In one aspect, the method is executed by a processor and comprises receiving, at a booking time, a booking request for an asset, the booking request including a pickup location and a pickup time; in response to the booking request, calculating a predicted quantity of assets at the pickup location and the pickup time based at least in part on current asset location information and future booking data, and calculating a target quantity of assets at the pickup location and the pickup time based on past booking data; calculating a discount parameter in accordance with said predicted quantity of assets and said target quantity of assets; and generating a booking price in accordance with the discount parameter.

Abstract: A communications module comprising a network interface for connecting to a packet data network, a memory storing communication client code, a connection interface that is arranged to connect to a consumer device to establish a set of connections between the communications module and the consumer device, wherein the connection interface comprises at least one connection for exchanging analogue call signals with the consumer device; and at least one data connector; and processing means configured to convert analogue call signals received from the consumer device into packet data and supply the packet data to the network interface, the processing means further configured to execute the communication client code stored in the memory and send user interface data for display at the consumer device via the data connector.

Abstract: An apparatus, method, and computer program product for scaling a rendered surface. The apparatus includes a graphics processor configured to render a surface at a source resolution, wherein a scaling parameter is associated with the surface, the scaling parameter defining the source resolution and a destination resolution. The apparatus further includes a display processor configured to scale the rendered surface to the destination resolution. Preferably, the scaling parameters are EGL surface attributes.

Abstract: Extrusion of feed materials of a high temperature formable non-ferrous metal susceptible to embrittlement during air processing uses an extrusion system having a rotatable wheel and shoe covering part of the length of a groove around the periphery of the wheel to form an arcuate passageway, the shoe having an abutment which substantially closes a second end of the passageway and an extrusion die spaced from the abutment by a die chamber. The process includes pre-heating the feed material to not less than about 390° C. in a chamber defined by a feeder device, maintaining a protective atmosphere in the chamber of the feeder device while the feed material is heated. The pre-heated feed material then is passed to an inlet end of the passageway, and drawn along the passageway, to be forced by the abutment into the die chamber and through an extrusion orifice of the die to provide extruded product.

Abstract: A communications module comprising a network interface for connecting to a packet data network, a memory storing communication client code, a connection interface that is arranged to connect to a consumer device to establish a set of connections between the communications module and the consumer device, wherein the connection interface comprises at least one connection for exchanging analogue call signals with the consumer device; and at least one data connector; and processing means configured to convert analogue call signals received from the consumer device into packet data and supply the packet data to the network interface, the processing means further configured to execute the communication client code stored in the memory and send user interface data for display at the consumer device via the data connector.