Abstract: A memory device, memory address decoder, a memory system and related method for memory attack detection are disclosed. An apparatus includes a memory decoder include multiple stages in a decoding path configured to generate a select signal from an input address signal, and fault detecting logic operably coupled with the memory decoder and configured to receive feedback signals distributed from the multiple stages indicative of a fault along the decoding path.

Abstract: A memory device, memory address decoder, a memory system and related method for memory attack detection are disclosed. An apparatus includes a memory decoder include multiple stages in a decoding path configured to generate a select signal from an input address signal, and fault detecting logic operably coupled with the memory decoder and configured to receive feedback signals distributed from the multiple stages indicative of a fault along the decoding path.

Abstract: Disclosed herein is a method that comprises applying a first voltage to a memory cell, applying again the first voltage to the memory cell when the memory cell have not been shifted to an erased condition, and applying a second voltage to the memory cell when the memory cell have not still been shifted to an erased condition, the second voltage being higher than the first voltage.

Abstract: Disclosed herein is a method that includes providing a non-volatile memory device which includes a plurality of cells, a plurality of selection transistors each having a gate and each coupled to associated one of the cells, and a selection line coupled in common to the gates of the selection transistors, applying a first program voltage to the selection line, and applying a second program voltage to the selection line when at least one of the selection transistors have not been shifted to a program condition.

Abstract: Disclosed herein is a method that comprises applying a first voltage to a memory cell, applying again the first voltage to the memory cell when the memory cell have not been shifted to an erased condition, and applying a second voltage to the memory cell when the memory cell have not still been shifted to an erased condition, the second voltage being higher than the first voltage.

Abstract: Disclosed herein is a method that comprises applying a first voltage to a memory cell, applying again the first voltage to the memory cell when the memory cell have not been shifted to an erased condition, and applying a second voltage to the memory cell when the memory cell have not still been shifted to an erased condition, the second voltage being higher than the first voltage.

Abstract: Disclosed here in a method that comprises performing an erase operation on multiple cells in a memory device, the performing comprising applying an erase voltage to the multiple cells, bit lines coupled to the multiple cells being thereby charged up; and discharging the bit lines by coupling the bit lines to a discharging line through a DC path.

Abstract: Disclosed herein is a device that includes a plurality of first word lines each extending from an associated one of the first terminals in a second direction toward to the second terminals and terminating between the first and second terminals, the second direction being substantially perpendicular to the first direction, and a plurality of second word lines each extending from an associated one of the second terminals in a third direction toward to the first terminals and terminating near to an end of an associated one of the first word lines, the third direction being opposite to the second direction, each of the second word lines being substantially aligned with an associated one of the first word lines.

Abstract: Disclosed herein is a method that includes providing a non-volatile memory device which includes a plurality of cells, a plurality of selection transistors each having a gate and each coupled to associated one of the cells, and a selection line coupled in common to the gates of the selection transistors, applying a first program voltage to the selection line, and applying a second program voltage to the selection line when at least one of the selection transistors have not been shifted to a program condition.

Abstract: A semiconductor device includes a first bonding pad, a second bonding pad, a wire bonded to a selected one of the first and second bonding pads, a power supply line electrically connected to the first bonding pad, and a voltage converter circuit coupled to the second bonding pad, the voltage converter circuit being activated when the wire is bonded to the second pad to produce an internal power voltage, which is different from a voltage received by the voltage converter circuit through the wire and the second bonding pad, and supply the internal power voltage to the power supply line, and the voltage converter circuit being deactivated when the wire is connected to the first bonding pad to allow the power supply line to receive a power voltage through the wire and the first bonding pad.

Abstract: Disclosed herein is a device that includes a plurality of first word lines each extending from an associated one of the first terminals in a second direction toward to the second terminals and terminating between the first and second terminals, the second direction being substantially perpendicular to the first direction, and a plurality of second word lines each extending from an associated one of the second terminals in a third direction toward to the first terminals and terminating near to an end of an associated one of the first word lines, the third direction being opposite to the second direction, each of the second word lines being substantially aligned with an associated one of the first word lines.

Abstract: Disclosed herein is a method that comprises applying a first voltage to a memory cell, applying again the first voltage to the memory cell when the memory cell have not been shifted to an erased condition, and applying a second voltage to the memory cell when the memory cell have not still been shifted to an erased condition, the second voltage being higher than the first voltage.

Abstract: Disclosed here in a method that comprises performing an erase operation on multiple cells in a memory device, the performing comprising applying an erase voltage to the multiple cells, bit lines coupled to the multiple cells being thereby charged up; and discharging the bit lines by coupling the bit lines to a discharging line through a DC path.

Abstract: A sense amplifier includes a first cascode transistor, a second cascode transistor, a first feedback circuit, a second feedback circuit, and a comparator. The drain of the first cascode transistor is connected directly to a first voltage source. The gate of the first cascode transistor is connected to the first feedback circuit and a first input of the comparator, and the source of the first cascode transistor is connected to the first feedback circuit and a first column decoder. The drain of the second cascode transistor is connected directly to a second voltage source. The gate of the second cascode transistor is connected to the second feedback circuit and a second input of the comparator, and the source of the second cascode transistor is connected to the second feedback circuit and a second column decoder.

Abstract: A sensing circuit with current offset functionality. In one embodiment, the sensing circuit includes a memory circuit having a first offset circuit operative to offset a first current. The sensing circuit also includes a reference circuit coupled to the memory circuit, where the reference circuit includes a second offset circuit operative to offset a second current. The sensing circuit also includes a compare circuit coupled to the memory circuit and the reference circuit, where the compare circuit determines the state of a memory cell based on first current and the second current. According to the system disclosed herein, the first and second offset circuits optimize the performance of the sensing circuit and prevent errors when determining the state of the memory cell.

Abstract: A flash memory includes input/output buffers, a memory array having memory cells coupled to the input/output buffers, and row and column decoders, and a voltage-generator circuit coupled to the row and column decoders. A microcontroller is coupled to the command user interface. Switch-instruction circuitry selectively provides instructions to the microcontroller from the read-only memory and from off chip through on-board t-latches coupled to the input/output buffers under control of a command user interface.

Abstract: A sense amplifier comprises a first cascode transistor, a second cascode transistor, a first feedback circuit, a second feedback circuit, and a comparator. The drain of the first cascode transistor is connected directly to a first voltage source. The gate of the first cascode transistor is connected to the first feedback circuit and a first input of the comparator, and the source of the first cascode transistor is connected to the first feedback circuit and a first column decoder. The drain of the second cascode transistor is connected directly to a second voltage source. The gate of the second cascode transistor is connected to the second feedback circuit and a second input of the comparator, and the source of the second cascode transistor is connected to the second feedback circuit and a second column decoder.

Abstract: In an embodiment, a non-volatile memory array wherein narrow word lines, as small as the minimum feature size width F, in separate strings, are extended outwardly from a non-volatile memory array and joined by wider connector segments. The joined word lines provide new opportunities. First, metal straps that can be formed to overlie the word lines can be joined by metal connector segments to the word lines. The connector segments can serve as an interface between the polysilicon word lines and the metal straps. Two adjacent word lines in the same string share a single metal strap using these segments thereby reducing the overall number of segments and contacts in the array. Increased width of the polysilicon joinder segments joining word lines in different strings, provides the opportunity for widening the connection beyond the minimum feature size so that contact may be readily made between the metal straps and the polysilicon word lines. Second, the joined word lines require fewer row decoder circuits.

Abstract: A memory system is disclosed. In one embodiment, the memory system includes a first bitline, where the first bitline produces a first transient current. The memory system also includes a sense amplifier coupled to the first bitline. The memory system also includes a second bitline coupled to the sense amplifier, where the second bitline produces a second transient current that is equal to the first transient current. The sense amplifier enables the first and second transient currents to be canceled. According to the system disclosed herein, the state of a memory cell may be determined without being adversely affected by transient currents.

Abstract: A redundant memory array has r columns of redundant memory cells, r redundant senses, and a redundant column decoder. Redundant address registers store addresses of defective regular memory cells. Redundant latches are provided in n groups of r latches. Redundancy comparison logic compares addresses of defective regular memory cells with an external input address. If the comparison is true, what is provided is: a DISABLE_LOAD signal to disable the regular senses for one of the n groups of m columns, an ENABLE_LATCH signal to one of the n groups of m columns to disables corresponding regular senses, and one or r REDO signals to a respective one of the r redundant latches in one of the n groups that is disabled. The selected one of the redundant latches activates one of the r redundant senses to access a redundant column.