Patents by Inventor Simone Frasca

Simone Frasca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers
    Patent number: 11735478
    Abstract: A method for manufacturing vias in a silicon wafer, the silicon wafer having a <110> crystal orientation, and having a <111> plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having a rhomboidal-shaped opening onto a surface of the silicon wafer, such that edges of the rhomboidal-shaped opening line up with a <111> plane of a crystalline structure of the silicon wafer, etching a hole in the silicon wafer at the rhomboidal-shaped opening, and polishing the hole after the etching by a anisotropic etching.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: August 22, 2023
    Assignee: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
    Inventors: Simone Frasca, Edoardo Charbon, Sandro Carrara, Rebecca Leghziel
  • System and Method for Removing Scalloping and Tapering Effects in High Aspect Ratio Through-Silicon Vias of Wafers
    Publication number: 20210351075
    Abstract: A method for manufacturing vias in a silicon wafer, the silicon wafer having a <110> crystal orientation, and having a <111> plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having a rhomboidal-shaped opening onto a surface of the silicon wafer, such that edges of the rhomboidal-shaped opening line up with a <111> plane of a crystalline structure of the silicon wafer, etching a hole in the silicon wafer at the rhomboidal-shaped opening, and polishing the hole after the etching by a anisotropic etching.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 11, 2021
    Inventors: Simone Frasca, Edoardo Charbon, Sandro Carrara, Rebecca Leghziel