Patents by Inventor Simranjit S. Khalsa

Simranjit S. Khalsa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated cable probe design for high bandwidth RF testing
    Patent number: 11226353
    Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: January 18, 2022
    Assignee: Intel Corporation
    Inventors: Chengqing Hu, Mayue Xie, Simranjit S. Khalsa, Deepak Goyal
  • INTEGRATED CABLE PROBE DESIGN FOR HIGH BANDWIDTH RF TESTING
    Publication number: 20210132113
    Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.
    Type: Application
    Filed: March 31, 2017
    Publication date: May 6, 2021
    Inventors: Chengqing Hu, Mayue Xie, Simranjit S. Khalsa, Deepak Goyal
  • High power terahertz impulse for fault isolation
    Patent number: 10746780
    Abstract: An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust a bandwidth of the impulse test signal. The test probe is electrically coupled to the signal generator circuit and configured to apply the impulse test signal to a device under test (DUT). The signal sensor circuit is configured to sense a conducted test signal produced by applying the impulse test signal to the DUT with the test probe. The defect detection circuit is configured to generate an indication of a defect in the DUT using the conducted test signal.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Deepak Goyal, Zhiguo Qian
  • HIGH POWER TERAHERTZ IMPULSE FOR FAULT ISOLATION
    Publication number: 20180335465
    Abstract: An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust a bandwidth of the impulse test signal. The test probe is electrically coupled to the signal generator circuit and configured to apply the impulse test signal to a device under test (DUT). The signal sensor circuit is configured to sense a conducted test signal produced by applying the impulse test signal to the DUT with the test probe. The defect detection circuit is configured to generate an indication of a defect in the DUT using the conducted test signal.
    Type: Application
    Filed: November 18, 2015
    Publication date: November 22, 2018
    Inventors: Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Deepak Goyal, Zhiguo Qian