Abstract: A semiconductor package comprises a semiconductor chip having bonding pads in the center area of surface thereof; a plurality of leads disposed on and attached to the upper surface of the chip by an attaching means. The attaching means covers all but the bonding pads of the chip. The leads have a bonding tip which is disposed on the side thereof and electrically connected to the bonding pads by bonding wires, and are arranged horizontally along the surface of the chip thereby providing large contact areas to the chip. A molding compound hermetically encloses the chip and the attaching means, and exposes the leads. The semicoductor package can be used in combination with an electrical circuit board having improved heat dissipation capability. The electrical circuit board includes a substrate comprised of a dielectric material, a circuit wiring formed on the substrate, and a plurality of heat dissipation pins disposed on the substrate in a pattern corresponding to leads of the semiconductor package.

Abstract: A semiconductor package is provided. A semiconductor chip including bonding pads has a plurality of leads disposed on and attached to the upper surface of the semiconductor chip. The leads include bonding tips that are electrically connected to the bonding pads by bonding wires. A molding compound encapsulates the chip and portions of the leads. Upper portions of the leads extend from the molding compound. The exposed upper portions of the leads may be connected to a circuit board. Heat dissipation from the semiconductor chip is facilitated with the disclosed package.