Abstract: A multilayer electronic component including: a body including a capacitance formation portion, cover portions disposed on surfaces on the capacitance formation portion opposing each other in one direction, and margin portions disposed on surfaces of the capacitance formation portion opposing each other in another direction; a first external electrode; a second external electrode, and the cover portions include a first-first buffer layer connected to the first external electrode and a first-second buffer layer connected to the second external electrode, and the margin portions include a second-first buffer layer connected to the first external electrode and a second-second buffer layer connected to the second external electrode, and the first-first buffer layer and the second-first buffer layer are connected to each other, and the first-second buffer layer and the second-second buffer layer are connected to each other.

Abstract: A multilayer electronic component, may include: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, the first surface including first and second band electrodes disposed to be spaced apart from each other; a first external electrode disposed on the third surface and connected to the first internal electrode and the first band electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second band electrode; a first plating layer disposed on the first external electrode and the first band electrode; and a second plating layer disposed on the second external electrode and the second band electrode.

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).

Abstract: A method of manufacturing a low temperature co-fired ceramic substrate includes preparing an alumina sheet, and a first LTCC sheet and a second LTCC sheet containing alumina powder and glass powder; forming a low temperature co-fired ceramic substrate structure by stacking the second LTCC sheet on the alumina sheet and the first LTCC sheet on the second LTCC sheet; and firing the low temperature co-fired ceramic substrate structure. The first LTCC sheet contains a smaller amount of glass powder than the second LTCC sheet.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a multilayer structure in which dielectric layers containing an alumina base material and internal electrode layers containing nickel are alternately stacked, plasticizing the multilayer structure by heating to a temperature of 500 to 900° C. at a first heating rate under a first reducing atmosphere at a first hydrogen concentration, sintering the multilayer structure by heating to a temperature of 1,250° C. to 1,400° C. at a second heating rate greater than the first heating rate under a second reducing atmosphere at a second hydrogen concentration higher than the first hydrogen concentration, and then maintaining the temperature of 1,250° C. to 1,400° C., and annealing the multilayer structure by cooling the multilayer structure to room temperature at a first cooling rate.