Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

Abstract: An inrush current limiting circuit (12) includes a transistor (Q), a switch element (M), and a short-circuit protection circuit (121). An emitter of the transistor is as an input of the inrush current limiting circuit. An input of the switch element is connected to a collector of the transistor. A second output of the switch element is as an output of the inrush current limiting circuit. A first terminal of the short-circuit protection circuit is connected to a first output of the switch element. A second terminal of the short-circuit protection circuit is connected to a base of the transistor. A third terminal of the short-circuit protection circuit is connected to the second output of the switch element.

Abstract: A power supply device (1) converting received power signals to direct current signals to ensure a load to work normally. The power supply device includes a transformer circuit (10), a rectifier circuit (11), and an inrush current control circuit (12). The transformer circuit converts the received power signals to alternating current signals. The rectifier circuit is connected to the transformer circuit, and converts the alternating current signals to direct current signals. The inrush current control circuit is connected to the rectifier circuit, for limiting inrush current from the power supply device. The inrush current control circuit includes a voltage divider resistor (R1) and a filter capacitor (C1). The filter capacitor is connected to the voltage divider resistor in series. In the invention, the power supply device uses the inrush current control circuit to limit the inrush current, thus life of the components is lengthened, and the power supply device is stable.