Patents by Inventor Sin Yee Chin

Sin Yee Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air cavity package using high temperature silicone adhesive
    Patent number: 11227806
    Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: January 18, 2022
    Assignee: Materion Corporation
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • Copper flanged air cavity packages for high frequency devices
    Patent number: 10163743
    Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 25, 2018
    Assignee: MATERION CORPORATION
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • COPPER FLANGED AIR CAVITY PACKAGES FOR HIGH FREQUENCY DEVICES
    Publication number: 20170338161
    Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 23, 2017
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • AIR CAVITY PACKAGE
    Publication number: 20170323837
    Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 9, 2017
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin