Patents by Inventor Sin-Yeob LEE

Sin-Yeob LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder reflow apparatus and method of manufacturing an electronic device
    Patent number: 11166351
    Abstract: In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sin-Yeob Lee, Dong-Woo Shin, Hyun-Seok Choi
  • SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
    Publication number: 20190174584
    Abstract: In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.
    Type: Application
    Filed: September 21, 2018
    Publication date: June 6, 2019
    Inventors: Sin-Yeob LEE, Dong-Woo SHIN, Hyun-Seok CHOI