Abstract: A method for manufacturing an electrolyte capacitor including at least the following steps: placing a valve-metal anode slug with its lower side on a substrate with a non-conductive epoxy target area without solder mask, curing the non-conductive epoxy, depositing a first conductive layer on the first end-face of the valve-metal anode slug and curing the first conductive layer, forming a dielectric on the valve-metal material of the valve-metal anode slug by anodization, depositing and curing a first non-conductive layer to cover an exposed surface of the first conductive layer, depositing a MnO2 layer and an electrically conductive coating, depositing a second conductive layer on the second end-face of the valve-metal anode slug and curing the second conductive layer, overmolding, and singulating of each single capacitor and the assembled substrate.

Abstract: An electrical ceramic capacitor, in particular a multilayer ceramic capacitor, comprising a ceramic body including a stack of parallel metallic layers of opposing polarity separated by a dielectric material arranged in an active zone of the ceramic body enclosed between outer surfaces, wherein at one or more surfaces a shock-absorbing region is arranged.

Abstract: A method for manufacturing an electrolyte capacitor including at least the following steps: placing a valve-metal anode slug with its lower side on a substrate with a non-conductive epoxy target area without solder mask, curing the non-conductive epoxy, depositing a first conductive layer on the first end-face of the valve-metal anode slug and curing the first conductive layer, forming a dielectric on the valve-metal material of the valve-metal anode slug by anodization, depositing and curing a first non-conductive layer to cover an exposed surface of the first conductive layer, depositing a MnO2 layer and an electrically conductive coating, depositing a second conductive layer on the second end-face of the valve-metal anode slug and curing the second conductive layer, overmolding, and singulating of each single capacitor and the assembled substrate.

Abstract: An electrical ceramic capacitor, in particular a multilayer ceramic capacitor, comprising a ceramic body including a stack of parallel metallic layers of opposing polarity separated by a dielectric material arranged in an active zone of the ceramic body enclosed between outer surfaces, wherein at one or more surfaces a shock-absorbing region is arranged.

Abstract: The present invention refers to a sensor unit (10, 10?) for an electronic module (1) which is small and lightweight comprising at least one exposed component (5, 5 a, 5b) containing a chemical element and/or a chemical compound at its surface which is adapted to undergo a color change observed in visible light due to presence of a corrosive, the exposed component preferably containing elementary copper. The invention further refers to a respective electronic module (1) and a procedure to calculate the level of corrosive exposure of such an electronic module (1).

Abstract: An aluminum slug anode usable in capacitors is produced from multiple-stacked layers of aluminum foils. The foils are stacked (possibly after cutting them to have an area similar to the area desired for the anode), hot-pressed, sintered, and anodized to generate the anode. A contact in electrical communication with the foils is formed, as by welding a contact across at least some of the foils. A capacitor casing be formed by situating the anode within a casing which serves as a cathode, with the anode being wrapped in a dielectric such as separator paper.

Abstract: A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.

Abstract: A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.

Abstract: An aluminum slug anode usable in capacitors is produced from multiple-stacked layers of aluminum foils. The foils are stacked (possibly after cutting them to have an area similar to the area desired for the anode), hot-pressed, sintered, and anodized to generate the anode. A contact in electrical communication with the foils is formed, as by welding a contact across at least some of the foils. A capacitor casing be formed by situating the anode within a casing which serves as a cathode, with the anode being wrapped in a dielectric such as separator paper.

Abstract: The invention relates to a flip chip wafer comprising an active surface having a plurality of bumps (40, 41, 42) formed thereon and having at least one layer of a cured underfill material (30, 35, 36) accommodated between said plurality of bumps (40, 41, 42). The invention further comprises a flip chip die as well as processes for manufacturing a flip chip wafer and a flip chip die.