Patents by Inventor Singo Ueda

Singo Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 3989678
    Abstract: A hot melt adhesive which comprises a copolyamide consisting essentialy of (1) .epsilon.-caprolactam, (2)(a) hexamethylenediamine and (b) at least one straight chain, saturated aliphatic dicarboxylic acid having 6 to 20 carbon atoms in a substantially equimolar ratio and (3)(a) at least one of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine and (b) at least one straight chain, saturated aliphatic dicarboxylic acid having 6 to 20 carbon atoms in a substantially equimolar ratio, the proportion of [A] the constituent unit essentially consisting of the component (1), [B] the contituent unit essentially consisting of the components (2)(a) and (2)(b) and [C] the constituent unit essentially consisting of the components (3)(a) and (3)(b) therein being within a pentagon circumscribed by the lines connecting the points P (82/17/1), Q (52/47/1), R (0/65/35), S (0/50/50) and T (86/7/7) in the graph as shown in FIG.
    Type: Grant
    Filed: September 13, 1973
    Date of Patent: November 2, 1976
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Kaoru Furukawa, Shinichiro Seki, Takashi Akiyama, Singo Ueda, Hideo Ikeda